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Special Articles: Recent Trends on MCM and Bare LSI Chip Mounting. Manufacturing Process of PWBs for the Substrate of MCM and Bare Chip Mounting. PTH Process.

机译：特殊文章：近期MCM和裸LSI芯片安装的趋势。用于MCM和裸芯片安装基板的PWB的制造过程。第3篇进程。

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Yoji KATO; Yoshikuni YAZAKI; Kaoru HARA;
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年度 1994
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1. Packaging alternatives to large silicon chips: tiled silicon on MCM and PWB substrates [J] . George A.G., Krusius J.P. IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging . 1996,第4期

机译：大型硅芯片的替代包装：MCM和PWB基板上的平铺硅片
2. Process Feasibility and Reliability Performance of Fine Pitch Si Bare Chip Embedded in Through Cavity of Substrate Core [J] . Han Younggun, Horiuchi Osamu, Hayashi Shigehiro, Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2015,第4期

机译：通过基板芯腔嵌入细间距硅裸芯片的工艺可行性和可靠性能
3. Brazil bares ambition to become global chip manufacturing hub [J] . Dylan McGrath Electronic Engineering Times . 2010,第feba22期

机译：巴西雄心勃勃成为全球芯片制造中心
4. Bare chip stacking structure for MCM production [C] . Kimura, T., Okuda, . 1998

机译：用于MCM生产的裸芯片堆叠结构
5. Special Articles: Recent Trends on MCM and Bare LSI Chip Mounting. Manufacturing Process of PWBs for the Substrate of MCM and Bare Chip Mounting. Full-Additive Process. [O] . Ryo ENOMOTO, Katsumi SAGISAKA 1994

机译：特殊文章：近期MCM和裸LSI芯片安装的趋势。用于MCM和裸芯片安装基板的PWB的制造过程。全添加过程。
6. MCM-C Multichip Module Manufacturing Guide [R] . Blazek, R. J., Kautz, D. R., Galichia, J. V. 2000

机译：mCm-C多芯片模块制造指南

Special Articles: Recent Trends on MCM and Bare LSI Chip Mounting. Manufacturing Process of PWBs for the Substrate of MCM and Bare Chip Mounting. PTH Process.

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