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Trends of MCM Application. MCM Assembly. Assembly Technology by Conductive Adhesive Resin.

机译：MCM应用的趋势。 MCM装配。导电粘合树脂组装技术。

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Kenzo HATADA;
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年度 1996
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专利

1. Study on the properties of conductive adhesives in various curing manners for MCM applications [J] . Hong Gao, GuoJun Hu, JinWen Zhou Journal of Adhesion Science and Technology: The International Journal of Theoredtical and Basic Aspects of Adhesion Science and Its Applications in All Areas of Technology . 2014,第18期

机译：MCM应用中各种固化方式的导电胶性能研究
2. Design tradeoffs among MCM-C, MCM-D and MCM-D/C technologies [J] . Iqbal A., Swaminathan M., Nealon M., IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part B, Advanced Packaging . 1994,第1期

机译：MCM-C，MCM-D和MCM-D / C技术之间的设计权衡
3. Design tradeoffs among MCM-C, MCM-D and MCM-D/C technologies [J] . Iqbal A., Swaminathan M., Nealon M., IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part B, Advanced Packaging . 1994,第1期

机译：MCM-C，MCM-D和MCM-D / C技术之间的设计权衡
4. Area bonding conductive (ABC) adhesives for flex circuit connection to LTCC/MCM substrates [C] . Bolger, J.C., Reynolds, Electronic Components and Technology Conference, 1995. Proceedings., 45th . 1995

机译：区域粘合导电（ABC）粘合剂，用于与LTCC / MCM基板的柔性电路连接
5. Process analysis and performance characterization of a novel anisotropic conductive adhesive for lead -free surface mount electronics assembly [D] . Ramkumar, S. Manian 2007

机译：用于无铅表面贴装电子组件的新型各向异性导电胶的工艺分析和性能表征
6. The Dbf4-Cdc7 kinase promotes Mcm2-7 ring opening to allow for single-stranded DNA extrusion and helicase assembly. [O] . Irina Bruck, Daniel L. Kaplan 2017

机译：Dbf4-Cdc7激酶促进Mcm2-7开环以允许单链DNA挤出和解旋酶组装。
7. Trends of MCM Application. MCM Assembly. Assembly Technology by Light-Setting Insulating Resin. [O] . Kenzo HATADA 1996

机译：MCM应用的趋势。 MCM装配。通过光凝绝缘树脂组装技术。

Trends of MCM Application. MCM Assembly. Assembly Technology by Conductive Adhesive Resin.

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