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Thermo-Viscoelastic Analysis of Warp Deformation and Residual Stress for Laminated Bodies of Flip-Chip Mounted LSI Device.

机译：倒装芯片安装LSI装置的叠层体脉冲变形和残余应力的热粘弹性分析。

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Shozo NAKAMURA; Koji SERIZAWA;
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年度 1997
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1. Thermo-viscoelastic analysis of thermal residual stress and warp deformation influenced by material properties in plastic laminated beams [J] . Shozo Nakamura, Masahiko Goto, Yoshiyuki Kushizaki 成形加工: プラスチツク成形加工学会志 . 2003,第4期

机译：受塑料叠层梁材料特性影响的热残余应力和翘曲变形的热粘弹性分析
2. Thermo-viscoelastic analysis of thermal residual stress and warp deformation influenced by material properties in plastic laminated beams [J] . Shozo Nakamura, Masahiko Goto, Yoshiyuki Kushizaki 成形加工: プラスチツク成形加工学会志 . 2003,第4期

机译：塑料层压梁材料特性受到热残余应力和经线变形的热 - 粘弹性分析
3. A three-dimensional thermo-viscoelastic analysis of process-induced residual stress in composite laminates [J] . Ding Anxin, Li Shuxin, Wang Jihui, Composite Structures . 2015,第octa期

机译：复合材料层压板过程致残余应力的三维热粘弹性分析
4. DOMINANT STRUCTURAL FACTORS OF LOCAL RESIDUAL STRESS IN THREE-DIMENSIONALLY STACKED LSI CHIPS MOUNTED USING FLIP CHIP TECHNOLOGY [C] . Nobuki Ueta, Hideo Miura ASME(American Society of Mechanical Engineers) InterPack Conference 2007(IPACK2007) . 2007

机译：倒装芯片安装三维叠层LSI芯片局部残余应力的支配结构因素
5. Underfill adhesion characteristics, residual stresses and analysis of thermal stresses in flip-chip packages. [D] . Sham, Man-Lung. 2003

机译：倒装芯片封装中的底部填充粘合特性，残余应力和热应力分析。
6. An Improved Analytical Solution for Process-Induced Residual Stresses and Deformations in Flat Composite Laminates Considering Thermo-Viscoelastic Effects [O] . Chao Liu, Yaoyao Shi 2018

机译：考虑热粘弹性效应的平面复合材料层板过程中残余应力和变形的改进解析解
7. Thermo-viscoelastic Analysis of Thermal Residual Stress and Warp Deformation Influenced by Material Properties in Plastic Laminated Beams [O] . Shozo Nakamura, Masahiko Goto, Yoshiyuki Kushizaki 2003

机译：塑料层压梁材料特性受到热残余应力和经翘曲变形的热粘弹性分析
8. ON THE GENERATION OF RESIDUAL STRESSES IN THERMO-VISCOELASTIC BODIES [R] . E. H. Lee, T. G. Rogers 1963

机译：关于热粘弹性体中残余应力的产生

Thermo-Viscoelastic Analysis of Warp Deformation and Residual Stress for Laminated Bodies of Flip-Chip Mounted LSI Device.

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