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B3.2 - A new packaging approach for reliable high temperature MEMS devices based on multilayer ceramic interposers

机译：B3.2 - 一种基于多层陶瓷中介体的可靠高温MEMS器件的新型包装方法

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F. Roscher; A. Otto; R. Döring; S. Rzepka; M. Wiemer; M. Ihle; St. Ziesche;
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年度 2013
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1. A Low-Temperature SU-8 Based Wafer-Level Hermetic Packaging for MEMS Devices [J] . Zine-El-Abidine I., Okoniewski M. Advanced Packaging, IEEE Transactions on . 2009,第2期

机译：基于低温SU-8的晶圆级密封封装，用于MEMS器件
2. Thermal management of BioMEMS: temperature control for ceramic-based PCR and DNA detection devices [J] . Sadler D.J., Changrani R., Roberts P., IEEE Transactions on Components and Packaging Technologies . 2003,第2期

机译：BioMEMS的热管理：基于陶瓷的PCR和DNA检测设备的温度控制
3. A 10 MHz to 80 GHz Low-Temperature Cofired Ceramic Ball Grid Array Board-to-Interposer Transition for Chip Scale Packages [J] . Thrasher B. A., McKinzie W. E. III, Nair D. M., Journal of Ceramic Science and Technology . 2015,第4期

机译：10 MHz至80 GHz低温COFired陶瓷球栅格阵列电路板 - 插入式芯片鳞片封装过渡
4. A new packaging approach for reliable high temperature MEMS devices based on multilayer ceramic interposers [C] . Frank Roscher, Alexander Otto, Ralf D?ring, AMA conference 2013 . 2013

机译：基于多层陶瓷中介层的可靠高温MEMS器件的新封装方法
5. High performance piezoelectric materials and devices for multilayer low temperature co-fired ceramic based microfluidic systems [D] . Zhang, Wenli 2011

机译：用于多层低温共烧陶瓷微流体系统的高性能压电材料和器件
6. A Novel Seedless TSV Process Based on Room Temperature Curing Silver Nanowires ECAs for MEMS Packaging [O] . Min Meng, Lijuan Cheng, Kai Yang, 2019

机译：基于室温固化银纳米线ECA的无种子TSV工艺用于MEMS包装
7. Low Temperature Synthesis of Electrode Films from Silver-Palladium Alloy Powders for Multilayer Ceramic Devices. [O] . Ryosuke Ueyama, Tamotu Ueyama, Takashi Yamamoto, 2000

机译：用于多层陶瓷器件的银 - 钯合金粉末的低温合成电极膜。
8. Injectable Ceramic Microcast Silicon Carbonitride (SiCN) microelectromechanical System (MEMS) for Extreme Temperature Environments with Extension: Micro Packages for Nano-Devices [R] . Bright, V. M. , Raj, R. , Dunn, M. L. , 2004

机译：用于极端温度环境的可注射陶瓷微型碳氮化硅（siCN）微机电系统（mEms），具有扩展功能：用于纳米器件的微型封装

B3.2 - A new packaging approach for reliable high temperature MEMS devices based on multilayer ceramic interposers

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