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Controlled dissolution of quartz material.Part I. Controlled dissolution of quartz plates in potassium and sodium hydroxides : chemical thinning down of SC cuts

机译:石英材料的受控溶解。第1 I.石英板在钾和氢氧化钠中的控制溶解:SC切割下的化学稀释

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摘要

From previous studies suggesting that controlled crystal growth and crystal dissolution are governed by the same laws, we have previously finalized the chemical lapping or controlled dissolution of AT quartz plates in NaOH,H2O. The quality of chemical polishing changes with the crystallographic orientation of plates. Consequently, we have investigated similar basic solvents other than NaOH medium to obtain a good chemical polishing of SC cuts. Surface roughness evolution was checked and shows that controlled dissolution of SC cuts has to take place in KOH medium. As shown in NaOH medium, initial surface state has a great influence on thinning down. Dissolution rates measured against temperature in different media and activation energies are compared.
机译:来自以前的研究表明,受控晶体生长和晶体溶解受相同的法律管辖,我们先前已经最终确定了在NaOH,H2O中的石英板的化学研磨或受控溶解。用板材的晶体取向改变化学抛光的质量。因此,我们研究了NaOH培养基以外的类似碱性溶剂,以获得SC切割的良好化学抛光。检查表面粗糙度进化并表明SC切割的受控溶解必须在KOH培养基中进行。如NaOH培养基所示,初始表面状态对稀疏的影响很大。比较了抗温度在不同介质和活化能量中测量的溶出速率。

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