首页> 外文OA文献 >Development of Highly Reliable Cu Wiring Technology for 2.1/2.5D-IC by Applying Semiconductor Manufacturing Process

【2h】

Development of Highly Reliable Cu Wiring Technology for 2.1/2.5D-IC by Applying Semiconductor Manufacturing Process

机译：通过应用半导体制造工艺，开发2.1 / 2.5D-IC的高度可靠的Cu布线技术

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Tsuyoshi Kanki; Junya Ikeda; Yoshihiro Nakata; Motoaki Tani; Tomoji Nakamura;
展开▼
作者单位

展开▼
年度 2015
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Highly Reliable and Manufacturable Ultrafine Pitch Cu–Cu Interconnections for Chip-Last Embedding With Chip-First Benefits [J] . Kumbhat N., Choudhury A., Mehrotra G., Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2012,第9期

机译：高度可靠且可制造的超细间距Cu-Cu互连，用于芯片最后嵌入，具有芯片优先优势
2. Taking nanotechnology to market: Applying semiconductor manufacturing to nanotechnology? [J] . Charles Hayward Solid state technology . 2005,第6期

机译：将纳米技术推向市场：将半导体制造应用于纳米技术？
3. The Investigation of 2D Channel Material Device in Semiconductor Process and Equipment Development by CMOS Manufacturing Technology [J] . Min-Cheng Chen 科儀新知 . 2016,第209期

机译：CMOS制造技术在半导体工艺与设备开发中的二维通道材料器件研究
4. A 5-驴m-width multi-layer wafer-level Cu wiring technology with resin CMP for highly-reliable FCBGA [C] . Kikuchi, Katsumi, Soejima, . 2007

机译：具有高度可靠的FCBGA的5按键宽度的多层晶圆级铜布线技术和树脂CMP
5. Development of highly diastereoselective FeCl3 catalyzed prins and Friedel-Crafts cyclization and investigation of highly substituted tetrahydropyrans via Cu(OTf)2-bisphosphine olefin migration-prins cyclization. [D] . Keyes, Chad A. 2014

机译：高度非对映选择性的FeCl3催化蛋白的开发和Friedel-Crafts环化，以及通过Cu（OTf）2-双膦烯烃迁移-蛋白环化对高度取代的四氢吡喃的研究。
6. Challenges and Recent Developments in Hearing Aids: Part II. Feedback and Occlusion Effect Reduction Strategies Laser Shell Manufacturing Processes and Other Signal Processing Technologies [O] . King Chung 2004

机译：助听器的挑战和最新发展：第二部分。减少反馈和遮挡效应的策略激光外壳制造工艺以及其他信号处理技术
7. Recent advance in the resources and material technology. Evaluation of a new Cu complex for the next generation semiconductor wiring and preparation of a Cu film. [O] . ATSUSHI SAI 1997

机译：最近的资源和材料技术进步。新一代半导体布线新型Cu复合物的评价及Cu膜的制备。
8. Semiconductor Measurement Technology: Survey of Optical Characterization Methodsfor Materials, Processing, and Manufacturing in the Semiconductor Industry [R] . Bullis, W. M., Perkowitz, S., Seiler, D. G. 1995

机译：半导体测量技术：半导体工业中材料，加工和制造的光学表征方法综述

Development of Highly Reliable Cu Wiring Technology for 2.1/2.5D-IC by Applying Semiconductor Manufacturing Process

著录项

引文网络

相似文献

相关主题

期刊订阅