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Physical, Electrical, and Reliability Considerations for Copper BEOL Layout Design Rules

机译：铜BEOL布局设计规则的物理，电气和可靠性考虑

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Eitan Shauly;
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年度 2018
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1. Electrical Characterization of the Copper CMP Process and Derivation of Metal Layout Rules [J] . S. Lakshminarayanan, Peter J. Wright, Jayanthi Pallinti IEEE Transactions on Semiconductor Manufacturing . 2003,第4期

机译：铜CMP工艺的电气特性和金属布局规则的推导
2. Electrical characterization of the copper CMP process and derivation of metal layout rules [J] . Lakshminarayanan S., Wright P.J., Pallinti J. IEEE Transactions on Semiconductor Manufacturing . 2003,第4期

机译：铜CMP工艺的电气特性和金属布局规则的推导
3. Design and Layout Strategy in the 60-V Power pLDMOS With Drain-End Modulated Engineering of Reliability Considerations [J] . Chen Shen-Li, Huang Yu-Ting Power Electronics, IEEE Transactions on . 2016,第7期

机译：考虑可靠性的漏极端调制工程的60V电源pLDMOS的设计和布局策略
4. BEoL Layout Design Considerations to Mitigate CPI Risk [C] . Mohamed A. Rabie, Thiagarajan Raman, Fahad Mirza, International Interconnect Technology Conference . 2018

机译：降低CPI风险的BEoL布局设计注意事项
5. Structural Optimization & Reliability of 3D Package by Studying Crack Behavior on TSV & BEOL & Impact of Power Cycling on Reliability Flip Chip Package [D] . Rahangdale, Unique. 2017

机译：三维封装的结构优化及可靠性研究TSV＆BEOL裂缝行为及功率循环对可靠性倒装芯片封装的影响
6. A General Design Rule to Manipulate Photocarrier Transport Path in Solar Cells and Its Realization by the Plasmonic-Electrical Effect [O] . Wei E. I. Sha, Hugh L. Zhu, Luzhou Chen, -1

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7. Closing the gap between electrical and physical design: The layout-aware solution [O] . Castro-López R., Roca Elisenda, Fernández Francisco V. 2013

机译：缩小电气和物理设计之间的差距：布局感知解决方案

Physical, Electrical, and Reliability Considerations for Copper BEOL Layout Design Rules

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