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Development of a rectangular dual-beam optical unit for YAG laser soldering of fine pitch flat package IC's.

机译：矩形双光束光学单元的开发，用于细间距平面封装IC的YAG激光焊接。

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Hiroshi MIURA; Kazumi ISHIKAWA; Keiji OKINO;
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年度 1989
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1. Numerical modelling of scanned beam laser soldering of fine pitch packages [J] . P. M. Beckett, A. R. Fleming, J. M. Gilbert, Soldering & Surface Mount Technology . 2002,第1期

机译：细间距封装的扫描光束激光焊接的数值模型
2. Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders [J] . Zongjie Han, Songbai Xue, Jianxin Wang, Journal of Electronic Packaging . 2009,第2期

机译：使用无铅焊料对小间距QFP器件进行激光焊接
3. Tensile strength of fine pitch QFP lead-free soldered joints with diode laser soldering [J] . Peng Xue, Song-bai Xue, Liang Zhang, Soldering & Surface Mount Technology . 2011,第3期

机译：采用二极管激光焊接的细间距QFP无铅焊接接头的拉伸强度
4. Laser beam soldering of fine-pitch technology packages with solid solder deposits [C] . Hans-Joerg Pucher, Univ. Erlangen-Nuernberg, Erlangen, Lasers as Tools for Manufacturing of Durable Goods and Microelectronics . 1996

机译：细间距技术封装的激光束焊接，带有固体焊料沉积
5. Assembly process development for fine pitch (0.4 mm) package-on-package devices in a lead-free assembly environment. [D] . Vijayanath, Vignesh. 2010

机译：在无铅组装环境中开发小间距（0.4 mm）层叠封装器件的组装工艺。
6. Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components [O] . Marina Makrygianni, Filimon Zacharatos, Kostas Andritsos, 2021

机译：通过激光引导的超细俯仰电子元件组装的激光诱导的前进转印的环保无铅焊膏印刷
7. YAG laser soldering system and soldering characteristics for flat package IC. [O] . Hiroshi MIURA, Kazumi ISHIKAWA, Satoru ARUGA 1988

机译：YAG激光焊接系统和扁平包装IC的焊接特性。

Development of a rectangular dual-beam optical unit for YAG laser soldering of fine pitch flat package IC's.

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