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Influence of Al Oxide Film on Thermocompression Bonding of Au Wire to Evaporated Al Film

机译：Al氧化膜对Au丝热压键合蒸发Al膜的影响

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Seiichi Iwata; Akitoshi Ishizaka; Hiroshi Yamamoto;
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年度 1981
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1. Oxidation Resistive, CMOS Compatible Copper-Based Alloy Ultrathin Films as a Superior Passivation Mechanism for Achieving 150 °C Cu–Cu Wafer on Wafer Thermocompression Bonding [J] . Asisa Kumar Panigrahi, Tamal Ghosh, Siva Rama Krishna Vanjari, Electron Devices, IEEE Transactions on . 2017,第3期

机译：抗氧化，CMOS兼容的铜基合金超薄膜，是通过晶圆热压键合实现150°C的Cu-Cu晶圆的优异钝化机理
2. Texture of Al films for wafer-level thermocompression bonding [J] . Nishant Malik, Vishnukanthan Venkatachalapathy, Wilhelm Dall, Superlattices and microstructures . 2017,第JUNa期

机译：晶圆级热压键合的Al膜织构
3. SEM and AES depth profile studies of thin titanium and titanium oxide films covered by nanoscale evaporated Au layers [J] . A. H. J. van den Berg, W. Lisowski, M. Smithers Fresenius' Journal of Analytical Chemistry . 1999,第1a3期

机译：纳米级蒸镀金层覆盖的钛和钛氧化物薄膜的SEM和AES深度分布研究
4. Surface oxide films on Aluminum bondpads: Influence on thermosonic wire bonding behavior and hardness [C] . M. Petzold, L. Berthold, D. Katzer, European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis . 2000

机译：铝粘合剂板上的表面氧化膜：对热循环键合行为的影响和硬度
5. Influence of mechanical and thermal boundary conditions on stabilizing/destabilizing mechanisms in evaporating liquid films [D] . Dharmavaram Narendranath, Aneet 2013

机译：机械和热边界条件对蒸发液膜中稳定/去稳定机理的影响
6. Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au–Au Bonding Using Ultrathin Au Films [O] . Michitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, 2019

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7. Effects of Ni-P Substrate Structure and Pd/Au Film Thicknesses on the Wire Bonding Strength of Electroless Au/Pd/Ni-P Films [O] . Yuichi Saito, Hajime Terashima, Takeshi Muramatsu, 2008

机译：Ni-P衬底结构和Pd / Au膜厚度对电镀AU / Pd / Ni-P膜引线键合强度的影响
8. Influence of Aluminum Oxide Film on Thermocompression Bonding of Gold Wire to Evaporated Aluminum Film [R] . Iwata, S., Ishizaka, A., Yamamoto, H. 1984

机译：氧化铝薄膜对金线与蒸发铝膜热压粘接的影响

Influence of Al Oxide Film on Thermocompression Bonding of Au Wire to Evaporated Al Film

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