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Formation of electronic defects in crystalline silicon during hydrogen plasma treatment

机译:在氢等离子体处理过程中形成晶体硅缺陷的形成

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摘要

Electronic defects in crystalline silicon induced by hydrogen plasma treatments are studied, based on in-situ photocurrent measurements and real-time spectroscopic ellipsometry. The electronic defects are generated by the plasma treatments, and annihilated partially by postannealing. The generation and annihilation of defects strongly depends on both the treatment time and the annealing temperature. A long-time plasma treatment results in the formation of the residual defects in the silicon bulk. The density of these defects is estimated to be of the order of 1013 cm−2. Interestingly, the electronic defects are formed even before a strong modification of the surface structure, i.e., the formation of a nanometer-scale disordered surface layer.
机译:研究了由氢等离子体处理诱导的晶体硅的电子缺陷,基于原位光电流测量和实时光谱椭偏针。电子缺陷由等离子体处理产生,并通过后终止部分湮灭。对缺陷的产生和湮灭强烈取决于治疗时间和退火温度。长时间血浆治疗导致硅散装中的残留缺陷形成。这些缺陷的密度估计为1013cm-2的顺序。有趣的是,即使在表面结构的强改性之前,也形成了电子缺陷,即形成纳米级无序表面层。

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