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Scratching of Graphene-Coated Cu Substrates Leads to Hardened Cu Interfaces with Enhanced Lubricity

机译：石墨烯涂覆的Cu基板的刮擦导致具有增强润滑性的硬化的Cu界面

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1. Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging [J] . Xiong Ming-yue, Zhang Liang Journal of Materials Science . 2019,第2期

机译：电子包装中不同基板上的Sn-Ag-Cu无铅焊点的界面反应和金属间化合物生长行为
2. Intermetallic compounds formed at the interface between Cu substrate and an Sn―9Zn―0.5Ag lead-free solder [J] . Tao-Chih Chang, Min-Hsiung Hon, Moo-Chin Wang Materials Research Bulletin . 2003,第5期

机译：在Cu基体和Sn―9Zn―0.5Ag无铅焊料之间的界面处形成金属间化合物
3. Enhancement of the wettability and solder joint reliability at the Sn-9Zn-0.5Ag lead-free solder alloy-Cu interface by Ag precoating [J] . Tao-Chih Chang, Ying-Tun Hsu, Min-Hsiung Hon Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2003,第1a2期

机译：Ag预涂提高了Sn-9Zn-0.5Ag无铅焊料合金-Cu界面的润湿性和焊点可靠性
4. Intermetallic compound formation on solder alloy/Cu-substrate interface using lead-free Sn-0.7Cu/recycled-Aluminum composite solder [C] . FLORA SOMIDIN, M. A. A. MOHD SALLEH, KHAIREL RAFEZI AHMAD International Conference on X-ray and Related Technique in Research and Industry . 2013

机译：使用无铅SN-0.7CU /再生铝合金焊料焊料合金/ Cu基底界面的金属间化合物形成
5. Strain relaxation in nm-thick Cu and Cu-alloy films bonded to a rigid substrate. [D] . Herrmann, Ashley Ann Elizabeth. 2016

机译：纳米厚的铜和铜合金薄膜与刚性基板结合时的应变松弛。
6. Suppressed Growth of (Fe Cr Co Ni Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging [O] . Yu-An Shen, Chun-Ming Lin, Jiahui Li, -1

机译：固态时效期间Sn-3.0Ag-0.5Cu焊料与FeCoNiCrCu0.5衬底之间的界面处（FeCrCoNiCu）Sn2金属间化合物的生长受到抑制
7. Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction [O] . Kotadia H. R., Panneerselvam A., Mokhtari O., 2012

机译：液相反应过程中焊料与Cu衬底之间的界面处Cu-Zn和Cu-Al金属间化合物大量剥落

Scratching of Graphene-Coated Cu Substrates Leads to Hardened Cu Interfaces with Enhanced Lubricity

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