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The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder

机译：SN-3.0AG-0.5CU-XSB高温无铅焊料的微观结构，热和机械性能

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Chaojun Li; Yanfu Yan; Tingting Gao; Guodong Xu;
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1. The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu- x Sb High-Temperature Lead-Free Solder [J] . Chaojun Li, Yanfu Yan, Tingting Gao, Materials . 2020,第19期

机译：SN-3.0AG-0.5CU-X SB高温无铅焊料的微观结构，热和机械性能
2. Effects of Ni Addition to Sn-5Sb High-Temperature Lead-Free Solder on Its Microstructure and Mechanical Properties [J] . Kobayashi Tatsuya, Mitsui Kohei, Shohji Ikuo Materials transactions . 2019,第6期

机译：SN-5SB高温无铅焊料中Ni的影响在其微观结构和机械性能下
3. Effect of rare earth Ce on the thermal behavior, microstructure and mechanical properties of Zn-30Sn-2Cu high temperature lead-free solder alloy [J] . Xianwei Zeng, Yichi Liu, Jiankang Zhang, Journal of materials science . 2020,第19期

机译：稀土CE对ZN-30SN-2CU高温无铅焊料合金热行为，微观结构和力学性能的影响
4. RESTORATION OF MICROSTRUCTURE AND MECHANICAL PROPERTIES OF LEAD-FREE BISMUTH CONTAINING SOLDER JOINTS AFTER ACCELERATED RELIABILITY TESTING USING A THERMAL TREATMENT [C] . Andre M. Delhaise, Mikaella Brillantes, Ivan Tan, SMTA international conference . 2018

机译：热处理加速可靠性测试后，含铅无铅焊料接头的组织和力学性能恢复
5. Mechanical Characterization and Aging Induced Evolution of Cyclic Properties and Microstructure of Lead-Free Solder Materials [D] . Chowdhury, Md Mahmudur Rahman. 2020

机译：机械表征和衰老诱导的无铅焊料材料的循环性能和微观结构演变
6. Microstructure Influence of SACX0307-TiO2 Composite Solder Joints on Thermal Properties of Power LED Assemblies [O] . Agata Skwarek, Przemysław Ptak, Krzysztof Górecki, 2020

机译：SACX0307-TiO2复合焊点的微观结构对功率LED组件热性能的影响
7. Effects of Ni Addition to Sn–5Sb High-Temperature Lead-Free Solder on Its Microstructure and Mechanical Properties [O] . Tatsuya Kobayashi, Kohei Mitsui, Ikuo Shohji 2019

机译：SN-5SB高温无铅焊料中Ni的影响在其微观结构和机械性能下

The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder

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