A Pilot Study on the Relationship between Mechanical and Electrical Loss Tangents of Glass Powder Reinforced Epoxy Composites Post-Cured in Microwaves

摘要

The mechanical and thermal properties of hollow glass powder reinforced epoxy resin composites have been measured and evaluated in earlier studies. This basic but critical and important data have caused interests in the relevant industry in Australia. This study is therefore carried out to measure and evaluate the dielectric properties of the composites with a view to benefit the relevant industry. The relationship between the dielectric and thermal properties will also be studied and correlated. The original contributions of this paper are that samples post-cured in conventional ovens have higher electrical as well as mechanical loss tangent values than their counterparts cured in microwaves only. The storage modulus of all samples post-cured conventionally is higher than its counterpart. This is in line with the fact that they are softer material with lower glass transition temperatures. For all percentages by weight of glass powder, the glass transition temperature for the microwave cured sample was higher and the composite was stiffer; the opposite was true for the conventionally cured samples.