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Lightweight porous silica foams with extreme-low dielectric permittivity and loss for future 6G wireless communication technologies

机译：轻量级多孔二氧化硅泡沫，具有极低介电介电常数和未来6G无线通信技术的损失

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Petra S. Pálvölgyi; Daniel Sebők; Imre Szenti; Eva Bozo; Henri Ervasti; Olli Pitkänen; Jari Hannu; Heli Jantunen; Marko E. Leinonen; Sami Myllymäki; Akos Kukovecz; Krisztian Kordas;
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1. Lightweight porous silica foams with extreme-low dielectric permittivity and loss for future 6G wireless communication technologies [J] . Petra S.Pálv(o)lgyi, Sami Myllym(a)ki, Akos Kukovecz, 纳米研究（英文版） . 2021,第005期

机译：轻量级多孔二氧化硅泡沫，具有极低介电介电常数和未来6G无线通信技术的损失
2. Lightweight porous silica foams with extreme-low dielectric permittivity and loss for future 6G wireless communication technologies [J] . Petra S.Pálvölgyi, Daniel Sebők, Imre Szenti, 纳米研究：英文版 . 2021,第005期

机译：轻量级多孔二氧化硅泡沫，具有极低介电介电常数和未来6G无线通信技术的损失
3. Hybrid Dielectric Resonator Antenna Composed of High-Permittivity Dielectric Resonator for Wireless Communications in WLAN and WiMAX [J] . Yih-ChienChen International journal of antennas and propagation . 2012,第2期

机译：由高介电常数介电共振器组成的混合介电共振器天线，用于WLAN和WiMAX中的无线通信
4. LIGHTWEIGHT POLYPROPYLENE-CARBON NANOTUBE FOAMS WITH LOW FILLER CONTENT, HIGH PERMITTIVITY AND LOW DIELECTRIC LOSS FOR CHARGE STORAGE APPLICATIONS [C] . A. Ameli, D. Jahani, M. Nofar Technical Conference of the Society of Plastics Engineers . 2014

机译：轻量级聚丙烯 - 碳纳米管泡沫，具有低填料含量，电介电常数高，电荷储存应用的低介电损耗
5. High-permittivity dielectrics and high mobility semiconductors for future scaled technology: Hafnium-based high-K gate dielectrics and interface engineering for hafnium oxide/germanium CMOS device [D] . Lu, Nan 2006

机译：适用于未来规模化技术的高介电常数电介质和高迁移率半导体：氧化ha /锗CMOS器件的Ha基高K栅极电介质和界面工程
6. Characterizing Dielectric Permittivity of Nanoscale Dielectric Films by Electrostatic Micro-Probe Technology: Finite Element Simulations [O] . He Ren, Wei-Feng Sun 2019

机译：用静电微探针技术表征纳米级电介质膜的介电常数：有限元模拟
7. Channel measurement and path loss modeling from 220 GHz to 330 GHz for 6G wireless communications [O] . Pan Tang, Jianhua Zhang, Haoyu Tian, 2021

机译：来自220 GHz到330 GHz的通道测量和路径损耗建模6G无线通信

Lightweight porous silica foams with extreme-low dielectric permittivity and loss for future 6G wireless communication technologies

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