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On low power and circuit parameter independent tests, and a new method of test response compaction

机译:在低功耗和电路参数独立测试中,以及一种新的测试响应压实方法

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摘要

Testing an integrated circuit once it has been manufactured is required in order to identify faulty and fault-free circuits. As the complexity of integrated circuits increases so does the difficulty of creating efficient and high quality tests that can detect a variety of defect types that can occur throughout the manufacturing process. Three issues facing manufacturing test are the power consumed during testing, addressing different types of fault, and test data volume.In regards to the power consumed during testing, abnormal switching activity, far above that seen by functional operation, may occur due to the testing technique of scan insertion. While scan insertion greatly simplifies test generation for sequential circuits, it may lead to excessive switching activity due to the loading and unloading of scan data and when the scan cells are updated using functional clocks. This can potentially damage the circuit due to excessive heat or inadvertently fail a good circuit due to current supply demands beyond design specifications.Stuck-at tests detect when lines are shorted to either the power supply or ground. Open faults are broken connections within the circuit. Some open faults may not be detected by tests generated for stuck-at faults. Therefore tests may need to be generated in order to detect these open faults. The voltage on the open node is determined by circuit parameters. Due to the feature size of the circuit it may not be possible to determine these circuit parameters, making it very difficult or impossible to generate tests for open faults.Automated test equipment is used to apply test stimuli and observing the output response. The output response is compared to the known fault-free response in order to determine if it is faulty or fault-free. Thus, automated test equipment must store the test stimuli and the fault-free responses in memory. With increased integrated circuit complexity, the number of inputs, outputs, and faults increase, increasing the overall data required for testing. Automated test equipment is very expensive, proportional to the memory required to store the test stimuli and fault-free output response. Simply replacing automated test equipment is not cost effective.These issues in the manufacturing test of integrated circuits are addressed in this dissertation. First, a method to reduce power consumption in circuits which incorporate data volume reduction techniques is proposed. Second, a test generation technique for open faults which does not require knowledge of circuit parameters is proposed. Third, a technique to further reduce output data volume in circuits which currently incorporate output response compaction techniques is proposed. Experimental results for the three techniques show their effectiveness.
机译:一旦制造了一旦制造了一个集成电路,以识别出故障和无故障电路。由于集成电路的复杂性增加,因此难以创建有效和高质量的测试,这些测试可以检测到整个制造过程中可以发生的各种缺陷类型。制造测试面临的三个问题是测试期间消耗的功率,解决了不同类型的故障,以及测试数据量。在测试期间消耗的功率,可能发生在测试期间的异常切换活动,可能由于测试而发生。扫描技术。虽然扫描插入极大地简化了顺序电路的测试生成,但由于扫描数据的加载和卸载以及使用功能时钟更新扫描单元时,它可能导致过度的切换活动。这可能会因过热或由于电流供应所需的良好电路而导致的电路可能会损坏电路,因为电流供需超出设计规格。 - 在测试时检测线路短路到电源或地面。打开故障是电路内的断开连接。可能无法通过对粘附性故障产生的测试来检测某些开放故障。因此,可能需要测试测试以检测这些开放性故障。打开节点上的电压由电路参数确定。由于电路的特征大小,可能无法确定这些电路参数,使得非常困难或无法生成开放故障的测试。使用测试设备来应用测试刺激并观察输出响应。将输出响应与已知的无故障响应进行比较,以便确定是否有故障或无故障。因此,自动测试设备必须存储测试刺激和内存中无故障响应。随着集成电路复杂性的增加,输入,输出和故障的数量增加,增加了测试所需的整体数据。自动测试设备非常昂贵,与存储测试刺激和无故障输出响应所需的内存成比例。简单地更换自动化测试设备并不具有成本效益。本论文解决了集成电路的制造测试中的问题。首先,提出了一种降低结合数据量减少技术的电路中的功耗的方法。其次,提出了不需要对电路参数知识的开封的测试生成技术。第三,提出了一种提出了一种进一步减少当前包含输出响应压缩技术的电路输出数据量的技术。三种技术的实验结果表明了它们的有效性。

著录项

  • 作者

    Joseph Michael Howard;

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  • 年度 -1
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  • 原文格式 PDF
  • 正文语种 eng
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