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Effect of surfactant on package substrate in chemical mechanical planarization

机译：表面活性剂对化学机械平面化封装基材的影响

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Soocheon Jang; Haedo Jeong; Minjong Yuh; Jaehong Park;
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年度 2015
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1. Effect of Surfactant on Package Substrate in Chemical Mechanical Planarization [J] . Soocheon Jang, Haedo Jeong, Minjong Yuh, International Journal Precision Engineering Manufacturing-Green Technology . 2015,第1期

机译：表面活性剂在化学机械平面化中对包装基材的影响
2. Chemical mechanical planarization of advanced package substrate by controlling selectivity of copper to polymer [J] . Jang Soocheon, Yuh Minjong, Lee Dasol, Journal of Mechanical Science and Technology . 2018,第8期

机译：通过控制铜对聚合物选择性的先进包装衬底的化学机械平坦化
3. Effect of Non-Ionic Surfactant on Chemical Mechanical Planarization Performance in Alkaline Copper Slurry [J] . Xu Qinzhi, Yang Fei, Chen Lan, International Journal of Precision Engineering and Manufacturing . 2018,第11期

机译：非离子表面活性剂对碱性铜浆料中化学机械平坦性能的影响
4. A PARADIGM SHIFT IN THE DEVELOPMENT OF CHEMICAL MECHANICAL POLISHING (CMP): COST-EFFECTIVE CMP PLANARIZATION IN NEXT GENERATION SUBSTRATE/PACKAGE DESIGN AND MANUFACTURING [C] . Stefanie Lotz, Robert Baresel, Dipto Thakurta, American Society of Mechanical Engineers(ASME)/Pacific RIM Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 pt.B; 20050717-22; San Francisco,CA(US) . 2005

机译：化学机械抛光（CMP）发展中的范式转移：下一代基料/包装设计和制造中具有成本效益的CMP平面化
5. Electrochemical studies of Copper, Tantalum and Tantalum Nitride surfaces in aqueous solutions for applications in chemical-mechanical and electrochemical-mechanical planarization. [D] . Sulyma, Christopher Michael. 2010

机译：用于化学机械和电化学机械平面化的水溶液中铜，钽和氮化钽表面的电化学研究。
6. Effect of Conditioner Type and Downforce and Pad Surface Micro-Texture on SiO2 Chemical Mechanical Planarization Performance [O] . Jeffrey McAllister, Calliandra Stuffle, Yasa Sampurno, 2019

机译：调节剂类型和下压力以及垫表面的微观结构对SiO2化学机械平面化性能的影响
7. Nickel phosphorus coated substrate micro-defect reduction through chemical mechanical planarization process optimization [O] . Mohd. Saleh Nazim 2014

机译：通过化学机械平面化工艺优化来减少磷化镍涂层衬底的缺陷

Effect of surfactant on package substrate in chemical mechanical planarization

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