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Analyses of steady and unsteady thermal behaviour of simulated electronic chips in a liquid cooled vertical rectangular channel

机译：液冷垂直矩形通道中模拟电子芯片稳态和不稳定的热行为分析

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Bhowmik Himangshu;
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1. Flow boiling critical heat flux of FC-72 from flush-mounted and protruded simulated chips in a vertical rectangular channel [J] . Tso CP., Xu GP., Tou KW. International Journal of Multiphase Flow . 2000,第3期

机译：在垂直矩形通道中从齐平安装和突出模拟芯片上流过的FC-72沸腾临界热通量
2. Computer Simulation of Mixed Convection of Alumina-Deionized Water Nanofluid Over Four In-Line Electronic Chips Embedded in One Wall of a Vertical Rectangular Channel [J] . Ramu Nalla, Ghoshdastidar P. S. Journal of Thermal Science and Engineering Applications: Transactions of the ASME . 2020,第4期

机译：四个垂直矩形通道的一墙上嵌入四墙上的氧化铝去离子水纳米流体混合对流的计算机模拟
3. UNSTEADY BUOYANCY-DRIVEN THERMAL CONVECTION IN A NON-DARCIAN POROUS MEDIUM VERTICAL CHANNEL WITH ASYMMETRIC HEATING/COOLING [J] . Joaquin Zueco, O. Anwar Beg, H. S. Takhar Journal of porous media . 2011,第1期

机译：具有非对称加热/冷却功能的非达西多孔中垂直通道中非稳态浮力驱动的热对流
4. Unsteady thermal behaviour of electronic chips inside FC-72 cooled channel [C] . Bhowmik H., Tou K.W., Tso C.P. Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th . 2004

机译：FC-72冷却通道内电子芯片的不稳定热行为
5. Circular and rectangular micro-channel designs for compact liquid-cooled heat sinks. [D] . Escandon, Rodrigo. 2011

机译：圆形和矩形微通道设计，用于紧凑型液冷散热器。
6. Thermal sensitivity of voltage-gated Na+ channels and A-type K+ channels contributes to somatosensory neuron excitability at cooling temperatures [O] . Ignacio Sarria, Jennifer Ling, Jianguo G. Gu -1

机译：电压门控Na +通道和A型K +通道的热敏灵敏度有助于冷却温度下的躯体感官神经元兴奋性
7. Thermal Analysis in a Channel Between Vertical Electronic Circuit Boards Cooled by Forced Convection. [O] . Xu Jiayu, Nobuyoshi Nakagawa, Kunio Kato 1996

机译：强制对流冷却垂直电子电路板之间的频道中的热分析。
8. Analysis by Conformal Mapping of Steady Frozen-Layer Configuration inside Cold Rectangular Channels Containing Warm Flowing Liquids Technical Note [R] . Savino, J. M., Siegel, R. 1970

机译：含温热液体冷矩形通道内稳态冻结层配置的共形映射分析技术说明

Analyses of steady and unsteady thermal behaviour of simulated electronic chips in a liquid cooled vertical rectangular channel

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