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Heat dissipation of Al₂O₃ Insulation layer Prepared by Anodizing Process for Metal PCB

机译：Al _{2 O _{3 绝缘层的散热通过阳极氧化方法，用于金属PCB}}

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Jae-Seung Jo; Jeong-Ho Kim; Sang-Won Ko; Sil-Mook Lim;
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年度 2015
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2. Constructal entransy dissipation rate minimization for variable cross-section insulation layer of the steel rolling reheating furnace wall [J] . Huijun Feng, Lingen Chen, Zhihui Xie, International communications in heat and mass transfer . 2014,第mara期

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4. Design and fabrication of metal PCB based on the patterned anodizing for improving thermal dissipation of LED lighting [C] . 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference . 2010

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8. Consequences of Anode Interfacial Layer Deletion. HCl-Treated ITO in P3HT:PCBM-Based Bulk-Heterojunction Organic Photovoltaic Devices [R] . Irwin, M. D., Liu, J., Leever, B. J., 2010

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Heat dissipation of Al2O3 Insulation layer Prepared by Anodizing Process for Metal PCB

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Heat dissipation of Al₂O₃ Insulation layer Prepared by Anodizing Process for Metal PCB