Grain flash temperatures in diamond wire sawing of silicon

机译：硅金刚锯的谷物闪光温度

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Uygar Pala; Stefan Süssmaier; Konrad Wegener;
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1. ( )The impact of silicon brick polishing on thin (120 mu m) silicon wafer sawing yields and fracture strengths in diamond-wire sawing [J] . Sekhar Halubai, Fukuda Tetsuo, Tanahashi Katsuto, Materials science in semiconductor processing . 2020,第期

机译：（）硅砖抛光对薄（120μm）硅晶片锯切产量和钻石线锯切断裂强度的影响
2. Diamond Wire Sawing of Solar Silicon Wafers: A Sustainable Manufacturing Alternative to Loose Abrasive Slurry Sawing [J] . Arkadeep Kumar, Shreyes N. Melkote Procedia Manufacturing . 2018,第2期

机译：太阳能硅晶片的金刚石线锯切：可持续的制造替代松散磨料浆锯切
3. A fracture mechanics approach to enhance product and process sustainability in diamond wire sawing of silicon wafers for solar cells through improved wire design [J] . Arkadeep Kumar, Shreyes N. Melkote International Journal of Sustainable Manufacturing . 2020,第2a4期

机译：通过改进的电线设计改善太阳能电池硅晶片硅晶片钻石锯材的产品和过程可持续性的裂缝力学方法
4. A COMPARISON OF RESIDUAL STRESS INDUCED BY FIXED ABRASIVE DIAMOND WIRE SAWING AND LOOSE ABRASIVE SLURRY WIRE SAWING IN MULTICRYSTALLINE SILICON WAFERS [C] . Vanessa Pogue, Shreyes Melkote, R. G. R. Prasath, European Photovoltaic Solar Energy Conference and Exhibition . 2016

机译：多晶硅硅晶片中固定磨石金刚石锯和松动磨料浆线锯切诱导的残余应力的比较
5. Synthesis of large-grained polycrystalline silicon by hot-wire chemical vapor deposition for thin film photovoltaic applications. [D] . Mason, Maribeth Swiatek. 2004

机译：通过热线化学气相沉积法在薄膜光伏应用中合成大晶粒多晶硅。
6. The Influence of Wire Speed on Phase Transitions and Residual Stress in Single Crystal Silicon Wafers Sawn by Resin Bonded Diamond Wire Saw [O] . Tengyun Liu, Peiqi Ge, Wenbo Bi 2021

机译：用树脂粘合金刚石锯锯制线速对相变硅晶片中的相变和残余应力的影响
7. A microscopic TEM study of the defect layers in cast-mono crystalline silicon wafers induced by diamond-wire sawing [O] . Hangfei Li, Xuegong Yu, Xiaodong Zhu, 2021

机译：金刚石锯切诱导铸造单晶硅晶片缺陷层的微观眼镜研究

Grain flash temperatures in diamond wire sawing of silicon

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