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Contamination of TEM Holders Quantified and Mitigated With the Open-Hardware, High-Vacuum Bakeout System

机译：用开放式硬件，高真空浮出系统量化和减轻温度夹持器的污染

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Yin Min Goh; Jonathan Schwartz; Emily Rennich; Tao Ma; Bobby Kerns; Robert Hovden;
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1. Contamination of TEM Holders Quantified and Mitigated With the Open-Hardware, High-Vacuum Bakeout System [J] . Goh Yin Min, Schwartz Jonathan, Rennich Emily, Microscopy and microanalysis: The official journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada . 2020,第5期

机译：用开放式硬件，高真空烤箱系统量化和减轻温度计的TEM保持器的污染
2. Static-charging mitigation and contamination avoidance by selective carbon coating of TEM samples [J] . Thomas Hoche, Jurgen W. Gerlach, Tino Petsch Ultramicroscopy . 2006,第11a12期

机译：通过对TEM样品进行选择性碳涂层来减轻静电和避免污染
3. An experimental system combined with a micromachine and double-tilt TEM holder [J] . Sato Takaaki, Tochigi Eita, Mizoguchi Teruyasu, Microelectronic Engineering . 2016,第octa期

机译：与微机和双倾斜TEM支架相结合的实验系统
4. Interaction between MRI RF field and pacemaker holders: A comparison between birdcage and TEM coils in 3 T systems [C] . Pisa S., Bernardi P., Bicchieri A., 5th European Conference on Antennas and Propagation . 2011

机译：MRI RF场和起搏器支架之间的相互作用：3 T系统中的鸟笼和TEM线圈之间的比较
5. Development of precision TEM holder assemblies for use in extreme environments. [D] . Bataineh, Khaled. 2005

机译：开发用于极端环境的精密TEM夹持器组件。
6. Assessing arsenic exposure in households using bottled water or point-of-use treatment systems to mitigate well water contamination [O] . Andrew E. Smith, Rebecca A. Lincoln, Chris Paulu, -1

机译：使用瓶装水或使用点处理系统评估家庭的砷暴露水平以减少井水污染
7. Static-charging mitigation and contamination avoidance by selective carbon coating of TEM samples [O] . Jürgen W. Gerlacha, Tino Petschb 2006

机译：通过TEm样品的选择性碳涂覆来避免静电充电和污染
8. A new approach for performing contamination control bakeouts in JPL thermal vacuum test chambers [R] . Johnson, Kenneth R., Taylor, Daniel M., Lane, Robert W., 1992

机译：在JpL热真空测试室中进行污染控制烘烤的新方法

Contamination of TEM Holders Quantified and Mitigated With the Open-Hardware, High-Vacuum Bakeout System

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