首页> 外文OA文献 >EVALUATION OF FAR-INFRARED BIB-TYPE GE DETECTORS FABRICATED WITH THE SURFACE-ACTIVATED WAFER BONDING TECHNOLOGY

【2h】

EVALUATION OF FAR-INFRARED BIB-TYPE GE DETECTORS FABRICATED WITH THE SURFACE-ACTIVATED WAFER BONDING TECHNOLOGY

机译：基于表面活化晶圆粘合技术制造的远红外围网型近型探测器的评价

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Misaki Hanaoka; Hidehiro Kaneda; Shinki Oyabu; Yasuki Hattori; Kotomi Tanaka; Sota Ukai; Kazuyuki Shichi; Takehiko Wada; Toyoaki Suzuki; Kentaroh Watanabe; Koichi Nagase; Shunsuke Baba; Chihiro Kochi;
展开▼
作者单位

展开▼
年度 2017
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Development of Blocked-Impurity-Band-Type Ge Detectors Fabricated with the Surface-Activated Wafer Bonding Method for Far-Infrared Astronomy [J] . Hanaoka M., Kaneda H., Oyabu S., Journal of Low Temperature Physics . 2016,第1a2期

机译：表面活化晶片键合法制备的远红外天文学中的杂质带状Ge探测器的开发
2. Electrical and Photoconductive Properties at 1.8 K of Germanium p~+-i Junction Device Fabricated by Surface-Activated Wafer Bonding [J] . Hidehiro Kaneda, Takehiko Wada, Shinki Oyabu, Japanese journal of applied physics . 2011,第6Issue1期

机译：表面活化晶圆键合制备的锗p〜+ -i结器件在1.8 K时的电和光电导性能
3. Microscopy and Electrical Properties of Ge/Ge Interfaces Bonded by Surface-Activated Wafer Bonding Technology [J] . Kentaroh Watanabe, Kensuke Wada, Hidehiro Kaneda, Japanese journal of applied physics.Part 1.Regular papers & short notes . 2011,第1ISSUE1期

机译：表面活化晶圆键合技术键合的Ge / Ge界面的显微学和电学性质
4. Combined Surface-Activated Bonding (SAB) Technologies for New Approach to Low Temperature Wafer Bonding [C] . Ran He, Masahisa Fujino, Akira Yamauchi, Semiconductor water bonding 13: science, Technology, and applications . 2014

机译：结合表面活化键合（SAB）技术的低温晶圆键合新方法
5. Heterostructurally integrated III-V semiconductors fabricated by wafer bonding technology. [D] . Shi, Fang Frank. 2004

机译：通过晶片键合技术制造的异质结构集成III-V半导体。
6. Gated Silicon Drift Detector Fabricated from a Low-Cost Silicon Wafer [O] . Hideharu Matsuura, Shungo Sakurai, Yuya Oda, 2015

机译：用低成本硅片制造的门控硅漂移检测器
7. Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient Air Using a Surface-Activated Bonding Method [O] . Eiji HIGURASHI, Ken OKUMURA, Yutaka KUNIMUNE, 2017

机译：使用表面活性粘合法在环境空气中具有光滑Au薄膜的晶片室温粘合

EVALUATION OF FAR-INFRARED BIB-TYPE GE DETECTORS FABRICATED WITH THE SURFACE-ACTIVATED WAFER BONDING TECHNOLOGY

著录项

引文网络

相似文献

相关主题

期刊订阅