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Thermoelastic Analysis of the Stress Distribution Near the Edge of the Interface between the Superconductive Thin Film and its Substrate. Application of a Boundary Element Method Using Fundamental Solution of Dissimilar Materials.

机译：超导薄膜与其基材之间界面边缘附近应力分布的热弹性分析。边界元法利用异种材料基本解的应用。

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Mamoru TAKAHASHI; Yotsugi SHIBUYA;
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年度 1998
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1. TRANSIENT THERMOELASTIC ANALYSIS FOR TWO-DIMENSIONAL DISSIMILAR MATERIALS BY THE BOUNDARY ELEMENT METHOD [J] . Toshio Furukawa, Hiroshi nakanishi, Mikio Miyamoto Journal of thermal stresses . 2000,第5期

机译：二维异种材料的瞬态热弹分析的边界元方法
2. Elastic-plastic boundary element analysis of interface edge in bonded dissimilar materials [J] . Jinquan Xu, Liedong Fu, Yoshiharu Mutoh 材料 . 2000,第8期

机译：粘结异常材料界面边缘的弹性塑性边界元分析
3. Elastic-plastic boundary element analysis of interface edge in bonded dissimilar materials [J] . Jinquan Xu, Liedong Fu, Yoshiharu Mutoh 材料 . 2000,第8期

机译：粘结异种材料界面边缘的弹塑性边界元分析
4. Stress Analysis of a Surface Crack Perpendicular to the Interface of Dissimilar Materials by Boundary Element Method [C] . I. Guven, E. Madenci 44th AIAA/ASME/ASCE/AHS Structures, Structural Dynamics, and Materials Conference ; 11th AIAA/ASME/AHS Adaptive Structures Conference ; 5th AIAA Non-Deterministic Approaches Forum ; 4th AIAA Gossamer Spacecraft Forum ; AIAA Dynamics Specialists Conference . 2003

机译：边界元法分析与异种材料界面垂直的表面裂纹的应力
5. Inverse boundary element/genetic algorithm method for reconstruction of multi-dimensional heat flux distributions with film cooling applications. [D] . Silieti, Mahmood K. 2004

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6. Error Estimation of Nanoindentation Mechanical Properties Near a Dissimilar Interface via Finite Element Analysis and Analytical Solution Methods [O] . Y. Zhao, T. C. Ovaert -1

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7. Singularity at the Interface Edge of Bonded Transversely Isotropic Piezoelectric Dissimilar Materials. 2nd Report. The Solution for an Interface Edge under Axisymmetric Deformation. [O] . Jinquan XU, Yoshiharu MUTOH 2000

机译：互补各向同性压电异常材料界面边缘处的奇点。第二次报告。轴对称变形下界面边缘的解决方案。

Thermoelastic Analysis of the Stress Distribution Near the Edge of the Interface between the Superconductive Thin Film and its Substrate. Application of a Boundary Element Method Using Fundamental Solution of Dissimilar Materials.

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