首页> 外文OA文献 >6.3.1 Modular Design Approach for Development of Electrical, Electronic, and Software System Architectures for Multiple Product Platforms
【2h】

6.3.1 Modular Design Approach for Development of Electrical, Electronic, and Software System Architectures for Multiple Product Platforms

机译:6.3.1用于多个产品平台开发电气,电子和软件系统架构的模块化设计方法

代理获取
本网站仅为用户提供外文OA文献查询和代理获取服务,本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文,但由于OA文献来源多样且变更频繁,仍可能出现获取不到、文献不完整或与标题不符等情况,如果获取不到我们将提供退款服务。请知悉。

摘要

Modular systems provide the ability to achieve product variety through the combination and standardization of components. Modular design approaches used in the development of electrical, electronic, and software (EES) systems allow sharing of architectures/modules between different product lines. Modular products provide economies of scale, reduced development time, reduced order lead‐time, and easier product diagnostics, maintenance and repair. In this paper, new optimization algorithms and software tools are presented that allow EES system design engineers to develop architectures/modules that can be shared across product platforms (for OEMs) and across OEMs (for suppliers). Approaches presented in this paper use matrix clustering and graph based techniques. The application of the approach is illustrated with an example from the automotive industry on the development of a modular EES system that can be shared across multiple vehicle platforms.
机译:模块化系统通过组合和标准化来实现实现产品种类的能力。用于开发电气,电子和软件(EES)系统的模块化设计方法,允许在不同产品线之间共享架构/模块。模块化产品提供规模经济,减少开发时间,减少订单循环时间,更简单的产品诊断,维护和维修。在本文中,提出了新的优化算法和软件工具,允许EES系统设计工程师开发可以在产品平台(用于OEM)和OEM(供应商)中共享的体系结构/模块。本文中提出的方法使用矩阵聚类和基于曲线图的技术。该方法的应用用来自汽车行业的示例进行了示例,用于开发可以在多个车辆平台上共享的模块化EES系统。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
代理获取

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号