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30 nm In0.7Ga0.3As Inverted-Type HEMTs with reduced gate leakage current for logic applications

机译: 0.7 掺杂型HEMTS,逻辑应用的栅极漏电流降低

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摘要

We have fabricated 30 nm In0.7Ga0.3As Inverted-Type HEMTs with outstanding logic performance, scalability and high frequency characteristics. The motivation for this work is the demonstration of reduced gate leakage current in the Inverted HEMT structure. The fabricated devices show excellent Lg scalability down to 30 nm. Lg = 30 nm devices have been fabricated with exhibit gm = 1.27 mS/mu m, S = 83 mV/dec, DIBL = 118 mV/V, ION/IOFF = 4 x 10[superscript 4], all at 0.5 V. More significantly, the removal of dopants from the barrier suppresses forward gate leakage current by over 100X when compared with equivalent normal HEMTs. The Lg = 30 nm devices also feature record high-frequency characteristics for an inverted-type HEMT design with fT = 500 GHz and fmax = 550 GHz.
机译:我们已经制造了30nm In0.7ga0.3as倒置式HEMT,具有出色的逻辑性能,可伸缩性和高频特性。这项工作的动机是倒置HEMT结构中闸门漏电流降低的动机。制造的设备显示出低至30nm的优异的LG可伸缩性。 LG = 30 nm器件已用图表GM = 1.27ms / mu m,s = 83 mV / dec,dibl = 118 mv / v,离子/ ioff = 4×10 [上标4],所有均为0.5 V.更多值得注意的是,与等效普通垫圈相比,从屏障中移除来自屏障的掺杂剂抑制了前部泄漏电流超过100倍。 LG = 30nm器件还具有用于倒置式HEMT设计的记录高频特性,FT = 500 GHz和Fmax = 550 GHz。

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