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Si and Cr Doping Effects on Growth and Mechanical Properties of UltrananocrystallineDiamond/Amorphous Carbon Composite Films Deposited on Cemented Carbide Substrates by Coaxial Arc Plasma Deposition

机译:通过同轴弧等离子体沉积沉积沉积在硬质合金基材上的超晶体晶体/非晶碳复合膜的生长和力学性能的Si和Cr掺杂作用

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摘要

Si and Cr doped ultrananocrystalline diamond/amorphous carbon composite films were deposited on cemented carbide (WC-Co) substrates by using coaxial arc plasma deposition with Si and Cr blended graphite targets. The undoped films deposited at room temperature and a repetition rate of arc discharges of 1 Hz have the maximum hardness of 51 GPa and Young’s modulus of 520 GPa. With increasing substrate temperature and repetition rate, the hardness and modulus are degraded, which might be because the growth of spFrom energy-dispersive X-ray spectroscopic measurements, the diffusion of Co atoms from the substrates into the films were observed for the Si-doped films. Since the Co diffusion induce the graphitization due to the catalytic effects, the degraded hardness and modulus of the Si doped films should be attributable to the catalytic effects of Co. For the Cr-doped films, the degraded hardness and modulus might be because of the Co catalytic effects being enhanced by the bombardment of Cr atoms whose atomic weight is much larger than that of C and the formation of chromium carbide. It was found that the doping of Si and Cr for the deposition of UNCD/a-C films deposited on WC-Co by CAPD is not effective for the improvement of the hardness and modulus.
机译:通过使用同轴弧等离子体沉积与Si和Cr混合的石墨靶沉积在硬弧等离子体沉积上沉积在硬质合金(WC-CO)底物上沉积Si和Cr掺杂的超晶金刚石/非晶碳复合膜。在室温下沉积的未掺杂薄膜和1Hz的电弧放电的重复率具有51GPa和杨氏模量的520GPa的最大硬度。随着基板温度和重复率的增加,硬度和模量降低,这可能是因为Sp从能量 - 分散X射线光谱测量的生长,观察到Si-掺杂的基材中的CO原子扩散到薄膜中电影。由于CO扩散由于催化效果导致的石墨化,因此Si掺杂薄膜的降解的硬度和模量应归因于Co.对于CR掺杂薄膜的催化作用,降低的硬度和模量可能是因为通过轰击的Cr原子轰击的CO催化效果,其原子体重远大于C的C和碳化铬的形成。发现Si和Cr用于沉积沉积在WC-Co上的UNC间/ A-C膜的掺杂对于改善硬度和模量来说是无效的。

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