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Analysis of tool-mass-acceleration effects onto sub-aperture computer controlled polishing (CCP)

机译:底孔电脑控制抛光(CCP)对刀具 - 批量加速效应分析

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摘要

Although computer controlled polishing (CCP) of aspheres and freeforms is one of the best understood state-of-the-art fab processes today, there are yet some unsolved issues: e.g. compared to bonnet polishing, fluid jet polishing is taking less iteration steps reaching the same form accuracy and ion beam figuring eventually is reaching much higher shape accuracies. This paper is a first move into solving this matter by introducing a novel footprint recording approach for CCP. To that aim, a new method for measuring the impact of a single tool mass acceleration value onto footprint shape is presented, the second derivative footprint recording (SECondo) method. First experimental evidence of the SECondo effect is presented, demonstrating that for bonnet polishing, acceleration of tool mass significantly alters the pressure distribution within the footprint and consequently affects its cross section
机译:尽管非球面和自由形式的计算机控制抛光(CCP)是当今最了解的先进fab工艺之一,但仍然存在一些未解决的问题:与阀盖抛光相比,流体喷射抛光采用较少的迭代步骤即可达到相同的形状精度,而离子束的设计最终将达到更高的形状精度。本文是通过引入一种新颖的CCP足迹记录方法来解决此问题的第一步。为此,提出了一种用于测量单个刀具质量加速度值对轮廓形状的影响的新方法,即二阶导数轮廓记录(SECondo)方法。首次展示了SECondo效应的实验证据,表明对于阀盖抛光,工具质量的加速会显着改变覆盖区中的压力分布,从而影响其横截面

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