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Tuning Electrochemical Bistability by Surface Area Blocking in the Cathodic Deposition of Copper

机译：铜阴极沉积中的表面积封闭电化学双稳定性

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Júlia Rospendowiski; Maria R. Pinto; Cristian Hessel; Elton Sitta; Raphael Nagao;
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1. Tuning Electrochemical Bistability by Surface Area Blocking in theCathodic Deposition of Copper [J] . Julia Rospendowiski, Maria R. Pinto, Cristian Hessel, ACS Omega . 2018,第10期

机译：通过铜阴极沉积中的表面积阻塞来调节电化学双稳态
2. Improving the electrochemical properties of Li1.2Mn0.52Co0.08Ni0.2O2 cathode material by uniform surface nanocoating with samarium fluoride through depositional-hydrothermal route [J] . Lu Chao, Wu Hao, Chen Baojun, Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2015,第Null期

机译：通过沉积-水热途径用氟化sa进行均匀的表面纳米涂覆来改善Li1.2Mn0.52Co0.08Ni0.2O2正极材料的电化学性能
3. Effect of Titanium Cathode Surface Condition on Initial Copper Deposition during Electrolytic Fabrication of Copper Foil [J] . Hiroaki Kurihara, Kazuo Kondo, Yasuyuki Okamoto Journal of Chemical Engineering of Japan . 2010,第4a7期

机译：钛阴极表面条件对电解制备铜箔过程中初始铜沉积的影响
4. Electrochemical Study of copper Deposition on Silicon Surfaces in HF Solutions [C] . I. Teerlinck, W.P. Gomes, K. Strubbe, Electrochemical processing in ULSI fabrication and semiconductor/metal deposition II . 1999

机译：HF溶液中硅表面铜沉积的电化学研究
5. In situ vibrational spectroscopic and electrochemical study of electrodeposition additives on copper surfaces. [D] . Biggin, Mary Ellen. 2001

机译：铜表面电沉积添加剂的原位振动光谱和电化学研究。
6. Tuning Electrochemical Bistability by Surface AreaBlocking in the Cathodic Deposition of Copper [O] . Júlia Rospendowiski, Maria R. Pinto, Cristian Hessel, 2018

机译：通过表面积调整电化学双稳态阻止铜的阴极沉积
7. Emergency of electrochemical bistability in the cathodic deposition of copper [O] . Julia Rospendowiski, Raphael Nagao de Sousa, Maria Rodrigues Pinto, 2019

机译：铜阴极沉积中电化学双稳态的紧急情况

Tuning Electrochemical Bistability by Surface Area Blocking in the Cathodic Deposition of Copper

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