首页> 外文OA文献 >Numerical analysis on thermal crack initiation due to non-homogeneous solder coating on the round strip interconnection of photo-voltaic modules

【2h】

Numerical analysis on thermal crack initiation due to non-homogeneous solder coating on the round strip interconnection of photo-voltaic modules

机译：光伏模块圆形条带互连上的非均匀焊料涂层因热裂纹启动的数值分析

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Alireza Eslami Mjad; Nduka Nnamdi Ekere;
展开▼
作者单位

展开▼
年度 2019
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Numerical analysis on thermal crack initiation due to non-homogeneous solder coating on the round strip interconnection of photo-voltaic modules [J] . Mjad Alireza Eslami, Ekere Nduka Nnamdi Solar Energy . 2019,第Deca期

机译：光伏组件圆带互连上不均匀焊料涂层引起热裂纹萌生的数值分析
2. Thermal Cycling Aging Effect on the Shear Strength, Microstructure, Intermetallic Compounds (IMC) and Crack Initiation and Propagation of Reflow Soldered Sn-3.8Ag-0.7Cu and Wave Soldered Sn-3.5Ag Ceramic Chip Components [J] . Andersson C., Tegehall P.-E., Andersson D. R., IEEE Transactions on Components and Packaging Technologies . 2008,第2期

机译：热循环时效对回流焊Sn-3.8Ag-0.7Cu和波峰焊Sn-3.5Ag陶瓷芯片组件的剪切强度，显微组织，金属间化合物（IMC）以及裂纹萌生和传播的影响
3. Crack initiation and growth in PV module interconnection [J] . Majd Alireza Eslami, Ekere Nduka Nnamdi Solar Energy . 2020,第Auga期

机译：光伏模块互连的开发和增长
4. NUMERICAL SIMULATION OF ENERGY RELEASE RATE FOR INTERFACE CRACK INITIATION DUE TO THERMAL STRESS IN ENVIRONMENTAL BARRIER COATINGS FOR SILICON CARBIDE (SIC) FIBER REINFORCED SIC MATRIX COMPOSITE [C] . Emi KAWAI, Yoshitaka UMENO Conference on Advanced Ceramic Matrix Composites: Science and Technology of Materials, Design, Applications, Performance and Integration . 2018

机译：碳化硅（SiC）纤维增强SiC矩阵复合材料环境阻挡涂层热应力引起的界面裂纹启动能量释放率的数值模拟
5. Processing and characterization of device solder interconnection and module attachment for power electronics modules. [D] . Haque, Shatil. 2000

机译：电力电子模块的设备焊料互连和模块连接的处理和表征。
6. Detection of segmentation cracks in top coat of thermal barrier coatings during plasma spraying by non-contact acoustic emission method [O] . Kaita Ito, Hitoshi Kuriki, Hiroshi Araki, 2014

机译：非接触声发射法检测等离子喷涂过程中热障涂层面层的开裂
7. Numerical analysis and thermal fatigue life prediction of solder layer in a SiC-IGBT power module [O] . Dianhao Zhang, Xiao-guang Huang, Bin-liang Cheng, 2020

机译：SiC-IGBT功率模块中焊料层的数值分析与热疲劳寿命预测

Numerical analysis on thermal crack initiation due to non-homogeneous solder coating on the round strip interconnection of photo-voltaic modules

著录项

引文网络

相似文献

相关主题

期刊订阅