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Applicability of focused Ion beam (FIB) milling with gallium, neon, and xenon to the fracture toughness characterization of gold thin films

机译：聚焦离子束（FIB）铣削与镓，氖和氙的适用性与金薄膜的断裂韧性表征

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Eva I. Preiß; Benoit Merle; Yuan Xiao; Florentina Gannott; Jan P. Liebig; Jeffrey M. Wheeler; Mathias Göken;
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1. Applicability of focused Ion beam (FIB) milling with gallium,neon,and xenon to the fracture toughness characterization of gold thin films [J] . Eva I. Preiβ, Benoit Merle, Yuan Xiao, Journal of Materials Research . 2021,第12期

机译：聚焦离子束（FIB）研磨与镓，氖和氙的适用性与金薄膜的断裂韧性表征
2. Characterization of TiN thin films subjected to nanoindentation using focused ion beam milling [J] . Ma LW, Cairney JM, Hoffman MJ, Applied Surface Science . 2004,第1a4期

机译：使用聚焦离子束铣削对经过纳米压痕的TiN薄膜进行表征
3. A flexible method for the preparation of thin film samples for in situ TEM characterization combining shadow-FIB milling and electron beam-assisted etching [J] . Liebig J. P., Goeken M., Richter G., Ultramicroscopy . 2016,第Null期

机译：结合阴影FIB铣削和电子束辅助蚀刻的灵活方法，用于制备用于原位TEM表征的薄膜样品
4. Combined electron beam induced current imaging (EBIC) and focused ion beam(FIB) techniques for thin film solar cell characterization [C] . Frank Altmann, Jan Schischka, Vinh Van Ngo, ISTFA 2010 : Conference proceedings from the 36th international symposium for testing and failure analysis . 2010

机译：结合电子束感应电流成像（EBIC）和聚焦离子束 r n（FIB）技术进行薄膜太阳能电池表征
5. MBE growth and processing of III/V-nitride semiconductor thin film structures: Growth of gallium indium arsenic nitride and nano-machining with focused ion beam and electron beam. [D] . Park, Yeonjoon. 2003

机译：MBE生长和III / V氮化物半导体薄膜结构的加工：氮化镓铟镓的生长以及离子束和电子束聚焦的纳米加工。
6. Thinning of Large Biological Cells for Cryo-TEM Characterization by Cryo-FIB Milling [O] . Korrinn M. Strunk, Danxia Ke, Jennifer L. Gray, -1

机译：用Cryo-Fib铣削稀释大型生物细胞进行冷冻眼镜表征
7. A Comparison of Xenon Plasma FIB Technology with Conventional Gallium LMIS FIB: Imaging, Milling, and Gas-Assisted Applications [O] . R Young, C Rue, S Randolph, 2011

机译：氙血浆FIB技术与常规镓LMIS FIB的比较：成像，研磨和气体辅助应用

Applicability of focused Ion beam (FIB) milling with gallium, neon, and xenon to the fracture toughness characterization of gold thin films

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