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Hybrid bidirectional transceiver for multipoint‐to‐multipoint signalling across on‐chip global interconnects

机译：混合双向收发器，用于跨片上全局互连的多点到多点信令

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Nijwm Wary; Antroy Roy Chowdhury; Pradip Mandal;
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1. Hybrid bidirectional transceiver for multipoint-to-multipoint signalling across on-chip global interconnects [J] . Wary Nijwm, Chowdhury Antroy Roy, Mandal Pradip Circuits, Devices & Systems, IET . 2020,第6期

机译：混合双向收发器，用于跨片上全局互连的多点到多点信令
2. A Bidirectional- and Multi-Drop-Transmission-Line Interconnect for Multipoint-to-Multipoint On-Chip Communications [J] . Ito H., Kimura M., Miyashita K., IEEE Journal of Solid-State Circuits . 2008,第4期

机译：多点到多点片上通信的双向和多点传输线互连
3. Current-Mode Triline Transceiver for Coded Differential Signaling Across On-Chip Global Interconnects [J] . Nijwm Wary, Pradip Mandal IEEE transactions on very large scale integration (VLSI) systems . 2017,第9期

机译：跨片上全局互连的编码差分信号的电流模式Triline收发器
4. Design of Simultaneous Bidirectional CMOS Transceiver with a Resistor Transconductor Hybrid for Optical Chip-to-Chip Interconnects [C] . Ikechi Augustine Ukaegbu, Jamshid Sangirov, Trong-Hieu Ngo, . 2011

机译：用于光芯片间互连的带有电阻跨导混合的双向双向CMOS收发器的设计
5. Driver pre-emphasis signaling for on-chip global interconnects. [D] . Zhang, Liang Leon. 2006

机译：片上全局互连的驱动器预加重信号。
6. Single-chip photonic transceiver based on bulk-silicon as a chip-level photonic I/O platform for optical interconnects [O] . Gyungock Kim, Hyundai Park, Jiho Joo, -1

机译：基于体硅的单芯片光子收发器作为用于光学互连的芯片级光子I / O平台
7. Wavelength-multiplexed duplex transceiver based on III-V/Si hybrid integration for off-chip and on-chip optical interconnects [O] . Chen, KX, Huang, Qiangsheng, Zhang, JH, 2016

机译：基于III-V / si混合集成的波长复用双工收发器，用于片外和片上光互连
8. Multipoint-to-Point and Point-to-Multipoint Space-Time Network Coding [R] . 2010

机译：多点对点和点对多点空时网络编码

Hybrid bidirectional transceiver for multipoint‐to‐multipoint signalling across on‐chip global interconnects

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