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The influence of MOVPE growth conditions on the shell of core-shell GaN microrod structures

机译:MOVPE生长条件对核心壳GAN MICROROD结构壳的影响

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摘要

A core-shell geometry is employed for most next-generation, three-dimensional opto-electric devices based on III–V semiconductors and grown by metal organic vapor phase epitaxy (MOVPE). Controlling the shape of the shell layers is fundamental for device optimization, however no detailed analysis of the influence of growth conditions has been published to date.ududWe study homogeneous arrays of gallium nitride core-shell microrods with height and diameter in the micrometer range and grown in a two-step selective area MOVPE process. Changes in shell shape and homogeneity effected by deliberately altered shell growth conditions were accurately assessed by digital analysis of high-resolution scanning electron microscope images.ududMost notably, two temperature regimes could be established, which show a significantly different behavior with regard to material distribution. Above 900 °C of wafer carrier temperature, the shell thickness along the growth axis of the rods was very homogeneous, however variations between vicinal rods increase. In contrast, below 830 °C the shell thickness is higher close to the microrod tip than at the base of the rods, while the lateral homogeneity between neighboring microrods is very uniform. This temperature effect could be either amplified or attenuated by changing the remaining growth parameters such as reactor pressure, structure distance, gallium precursor, carrier gas composition and dopant materials. Possible reasons for these findings are discussed with respect to GaN decomposition as well as the surface and gas phase diffusion of growth species, leading to an improved control of the functional layers in next-generation 3D V–III devices.
机译:基于III-V半导体的大多数下一代的三维光电装置使用核心壳几何体,并被金属有机气相外延(MOVPE)生长。控制壳层的形状是设备优化的基础,但是没有详细分析增长条件的影响已发布于迄今为止。 UD Udwe研究氮化镓核心壳微孔的均匀阵列,高度和千分尺在两步选择性区域MOVPE过程中的范围和生长。通过对高分辨率扫描电子显微镜图像的数字分析准确地评估了通过故意改变的壳生长条件进行的壳体形状和均匀性的变化。 UD 最多,可以建立两个温度制度,这表明了一个显着不同的行为材料分布。在900℃的晶片载体温度以上,沿杆的生长轴的壳厚度非常均匀,然而邻近杆之间的变化增加。相反,在830°C以下壳体厚度靠近微孔尖端,而不是杆的底部,而相邻微火箭之间的横向均匀性非常均匀。通过改变剩余的生长参数,例如反应器压力,结构距离,镓前体,载气组合物和掺杂剂材料,可以通过改变剩余的生长参数来扩增或衰减该温度效应。这些发现的可能原因是关于GaN分解的讨论以及生长物种的表面和气相扩散,导致下一代3D V-III器件中的功能层的改进控制。

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