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Electrode Properties of Thin Film Battery with LiCoO2Cathode Deposited by R.F. Magnetron Sputtering at Various Ar Partial Pressures

机译：用R.F的LiCoO2cathode薄膜电池的电极特性。磁控溅射在各种AR部分压力下

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H.Y. Park; Y.C. Lim; K.G. Choi; K.C. Lee; G.B. Park; M.Y. Kwon; S.B. Cho; S.C. Nam;
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1. Effects of gas pressure and r.f. power on the growth and properties of magnetron sputter deposited amorphous carbon thin films [J] . J.L. Andujar, F.J. Pino, M.C. Polo, Diamond and Related Materials . 2002,第3a6期

机译：气压和r.f.的影响对磁控溅射沉积非晶碳薄膜的生长和性能的影响
2. Co,Ni-base alloy thin films deposited by r.f. magnetron sputtering in Ar/N2 atmosphere [J] . M. Leoni, C. Tosi, P. Scardi Journal of Materials Science . 2005,第7期

机译：射频沉积Co，Ni基合金薄膜Ar / N2 气氛中的磁控溅射
3. Co,Ni-base alloy thin films deposited by r.f. magnetron sputtering in Ar/N-2 atmosphere [J] . Leoni M, Tosi C, Scardi P Journal of Materials Science . 2005,第7期

机译：射频沉积Co，Ni基合金薄膜Ar / N-2气氛中的磁控溅射
4. The Influence of Total and Oxygen Partial Pressures on Structure and Hydrophilic Property of TiO_2 Thin Films Deposited by Reactive DC Magnetron Sputtering [C] . S. Chaiyakun, A. Buranawong, T. Deelert, International Conference on Smart Materials - Smart/Intelligent Materials and Nanotechnology . 2008

机译：总反应直流磁控溅射沉积的TiO_2薄膜结构和亲水性的影响
5. Evaluation of structure and material properties of RF magnetron sputter-deposited yttria-stabilized zirconia thin films. [D] . Piascik, Jeffrey Robert. 2007

机译：射频磁控溅射沉积的氧化钇稳定的氧化锆薄膜的结构和材料性能评估。
6. Influence of Oxygen Concentration on the Performance of Ultra-Thin RF Magnetron Sputter Deposited Indium Tin Oxide Films as a Top Electrode for Photovoltaic Devices [O] . Jephias Gwamuri, Murugesan Marikkannan, Jeyanthinath Mayandi, 2016

机译：氧浓度对超薄射频磁控溅射沉积铟锡氧化物薄膜作为光伏器件上电极的性能的影响
7. The Effects of Ar Pressure on Corrosion and Structural Property of r.f. Magnetron Sputtered AlN Thin Film Deposited on Al-Mg Alloy. [O] . Kenji YAMAMOTO, Takenori NAKAYAMA, Hiroshi SATOH 1997

机译：AR压力对R.F的腐蚀和结构性质的影响。磁控溅射Aln薄膜沉积在Al-Mg合金上。

Electrode Properties of Thin Film Battery with LiCoO2Cathode Deposited by R.F. Magnetron Sputtering at Various Ar Partial Pressures

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