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Detector-electrode for alpha spectrometry in water sample, numerical and early feasibility investigation toward thermocompression bonding assembly process

机译：用于α光谱法的检测器电极，在水样中，对热压粘合组装过程的数值和早期可行性研究

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N. Schmitt; S. Colas; N. Saurel; F. Bassignot; B. Vuillemin; J.-E. Groetz;
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年度 2020
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1. Detector-electrode for alpha spectrometry in water sample, numerical and early feasibility investigation toward thermocompression bonding assembly process [J] . N. Schmitt, S. Colas, N. Saurel, Nuclear instruments and methods in physics research . 2020,第Feba11期

机译：用于水样中α光谱的检测电极，对热压键合组装过程进行数值和早期可行性研究
2. Cost Analysis of Flip Chip Assembly Processes: Mass Reflow with Capillary Underfill and Thermocompression Bonding with Nonconductive Paste [J] . Amy Palesko Lujan Advancing Microelectronics . 2016,第1期

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3. Numerical analysis of the interfacial contact process in wire thermocompression bonding [J] . Takahashi Y., Shibamoto S. IEEE transactions on components, packaging, and manufacturing technology. Part A . 1996,第2期

机译：导线热压键合中界面接触过程的数值分析
4. Thermocompression Bonding Process Design and Optimization for Warpage Mitigation of Ultra-Thin Low-CTE Package Assemblies [C] . Vidya Jayaram, Scott McCann, Ting-Chia Huang, The 66th Electronic Components and Technology Conference . 2016

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机译：用于硅互连织物的电力输送和热萃取系统的铜铜热压粘合工艺开发
6. Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration [O] . Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, 2016

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7. Applications of PERALS-Alpha Spectrometry for the Investigation of Radionuclides in Water Samples [O] . Markus Raymond Zehringer, Franziska Kammerer, Anja Pregler 2021

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Detector-electrode for alpha spectrometry in water sample, numerical and early feasibility investigation toward thermocompression bonding assembly process

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