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Investigation of the Microstructure of Mn-doped Tin-Silver-Copper Solder Alloys Solidified with Different Cooling Rates

机译：用不同冷却率固化的Mn掺杂锡 - 银铜焊料合金微观结构研究

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Tamas Hurtony; Oliver Krammer; Balazs Illes; Peter Gordon;
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1. Effect of Cooling Rate on Microstructure and Strength Properties of Tin-Silver-Copper Solder Ball Bonding [J] . Kunihiro Noguchi, Mayumi Ikeda, Isao Shimizu Materials transactions . 2001,第5期

机译：冷却速度对锡银铜焊料球结合组织和强度性能的影响
2. Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, tensile strength and ductile-brittle transition temperature [J] . K.N. Prabhu, Parashuram Deshapande, Satyanarayan Materials Science and Engineering . 2012,第期

机译：Sn-9Zn无铅焊料合金凝固过程中的冷却速度对其组织，拉伸强度和脆性转变温度的影响
3. An investigation of microstructure and mechanical properties of novel Sn3.5Ag0.5Cu-XTiO_2 composite solders as functions of alloy composition and cooling rate [J] . L.C. Tsao Materials Science and Engineering . 2011,第期

机译：新型Sn3.5Ag0.5Cu-XTiO_2复合焊料的微观组织和力学性能随合金成分和冷却速率的变化
4. Investigating the Fine Microstructure of Mn-doped SnAgCu Solder Alloys by Selective Electrochemical Etching [C] . Oliver Krammer, Tamás Hurtony Electronic System-Integration Technology Conference . 2018

机译：通过选择性电化学刻蚀研究Mn掺杂SnAgCu焊料合金的精细组织
5. Thermal processes and solidification kinetcs of evolution of the microstructure of tin-silver-copper solder alloys. [D] . Kinyanjui, Robert Kamau. 2005

机译：锡-银-铜焊料合金微观结构演变的热过程和凝固动力学。
6. Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates [O] . Tamás Hurtony, Oliver Krammer, Balázs Illés, 2020

机译：用不同冷却率固化Mn合金锡 - 银铜焊料力学性能的研究
7. Effects of Cooling Rates on Microstructure, Wettability and Strength of Sn3.8Ag0.7Cu Solder Alloy [O] . Siti Rabiatull Aisha Idris, Nadhrah Murad, M. Ishak 2017

机译：冷却速率对Sn3.8Ag0.7Cu焊料合金的组织，润湿性和强度的影响

Investigation of the Microstructure of Mn-doped Tin-Silver-Copper Solder Alloys Solidified with Different Cooling Rates

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