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Dimensional reduction analysis for Physical Layer device fingerprints with application to ZigBee and Z-Wave devices

机译：用于ZigBee和Z波器件的物理层设备指纹的尺寸减小分析

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Trevor J. Bihl; Kenneth W. Bauer; Michael A. Temple; Benjamin Ramsey;
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年度 2015
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1. Application of Three-Dimensional Electromagnetic Analysis Methods to Electrical Machinery and Devices, Part II: Applications [J] . Chari M. V. K., DAngelo J., Palmo M. A., Power Engineering Review, IEEE . 1986,第6期

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2. Investigation of fundamental physical properties of CdSiP_2 and its application in solar cell devices by using (ZnX; X = Se, Te) buffer layers [J] . A.S. Verma, Ruchita Gautam, Pravesh Singh, Materials Science and Engineering . 2016,第Mara期

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3. Analysis of copper ion filaments and retention of dual-layered devices for resistance random access memory applications [J] . Jaesik Yoon, Joonmyoung Lee, Hyejung Choi, Microelectronic Engineering . 2009,第7a9期

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4. Dimensional reduction analysis for Physical Layer device fingerprints with application to ZigBee and Z-Wave devices [C] . Bihl Trevor J., Bauer Kenneth W. Jr., Temple Michael A., IEEE Military Communications Conference . 2015

机译：物理层设备指纹的降维分析及其在ZigBee和Z-Wave设备中的应用
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7. An Optimization Framework for Generalized Relevance Learning Vector Quantization with Application to Z-Wave Device Fingerprinting [O] . Bihl Trevor, Temple Michael, Bauer Kenneth 2017

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Dimensional reduction analysis for Physical Layer device fingerprints with application to ZigBee and Z-Wave devices

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