首页> 外文OA文献 >PROCESS DEPENDENCE OF BREAKDOWN FIELD IN THERMALLY NITRIDED SILICON DIOXIDE
【2h】

PROCESS DEPENDENCE OF BREAKDOWN FIELD IN THERMALLY NITRIDED SILICON DIOXIDE

机译:热氮化硅中的击穿场的过程依赖性

摘要

We have studied the dependence of breakdown field in nitrided oxides on nitridation conditions. Nitridation improves the breakdown field of the oxides. In an attempt to explore the cause of the improved breakdown, the breakdown field was related with electron-trap density and refractive index (which increases with nitrogen concentration in the oxide). Our results suggest that the enhanced breakdown field of nitrided oxides is mainly due to incorporation of nitrogen, which results in structural changes in the nitrided oxide.
机译:我们研究了氮化氧化物中击穿场对氮化条件的依赖性。氮化改善了氧化物的击穿场。为了探索改善击穿的原因,击穿场与电子陷阱密度和折射率(随氧化物中氮浓度的增加而增加)有关。我们的结果表明,氮化物击穿场的增强主要归因于氮的掺入,这导致氮化物的结构发生变化。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号