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Improved pitting corrosion behaviour of electrodeposited nanocrystalline Ni–Cu alloys in 3.0 wt. NaCl solution

机译:改善了电沉积的纳米晶Ni-Cu合金在3.0 wt。%NaCl溶液中的点蚀性能

摘要

Nanocrystalline (nc) Ni–Cu alloys have been electrodeposited by using pulse current (PC) as well as direct current (dc) electrolysis. X-ray diffraction (XRD) and transmission electron microscopy (TEM) were employed to characterise the deposits. High-resolution electron microscopic (HREM) examination revealed that deposited nc alloys were dense in nature. Corrosion behaviour of both nc as well as Monel-400 were compared in 3.0 wt.% NaCl solution and was found that corrosion current density (icorr) of nc alloys were superior to Monel-400. Both optical as well as scanning electron microscopic (SEM) examination of the corroded surface revealed a well-defined pitting type of attack for Monel-400 unlike nc alloys; akin to homogeneous corrosion.
机译:纳米晶(nc)Ni-Cu合金已经通过脉冲电流(PC)以及直流(dc)电解进行了电沉积。 X射线衍射(XRD)和透射电子显微镜(TEM)用于表征沉积物。高分辨率电子显微镜(HREM)检查显示,沉积的nc合金本质上是致密的。比较了nc和Monel-400在3.0 wt。%NaCl溶液中的腐蚀行为,发现nc合金的腐蚀电流密度(icorr)优于Monel-400。对腐蚀表面的光学和扫描电子显微镜(SEM)检查都表明,与nc合金不同,Monel-400具有明确的点蚀类型。类似于均匀腐蚀。

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