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Study of P/E Cycling Endurance Induced Degradation in SANOS Memories Under NAND (FN/FN) Operation

机译:NAND(FN / FN)操作下SANOS存储器中P / E循环耐力引起的退化的研究

摘要

Program/Erase (P/E) cycling endurance in poly-Si/Al(2)O(3)/SiN/SiO(2)/Si (SANOS) memories is systematically studied. Cycling-induced trap generation, memory window (MW) closure, and eventual stack breakdown are shown to be strongly influenced by the material composition of the silicon nitride (SiN) charge trap layer. P/E pulsewidth and amplitude, as well as starting program and erase flatband voltage (V(FB)) levels (therefore the overall MW), are shown to uniquely impact stack degradation and breakdown. An electron-flux-driven anode hole generation model is proposed, and trap generation in both SiN and tunnel oxide are used to explain stack degradation and breakdown. This paper emphasizes the importance of SiN layer optimization for reliably sustaining large MW during P/E operation of SANOS memories.
机译:系统地研究了多晶硅/ Al(2)O(3)/ SiN / SiO(2)/ Si(SANOS)存储器中的程序/擦除(P / E)循环耐久性。循环诱导陷阱的产生,存储器窗口(MW)的关闭以及最终的堆栈击穿都受到氮化硅(SiN)电荷陷阱层的材料成分的强烈影响。 P / E脉冲宽度和幅度,以及启动编程和擦除平带电压(V(FB))的水平(因此,总MW)显示出独特地影响电池组的退化和击穿。提出了一种由电子通量驱动的阳极空穴产生模型,并用SiN和隧道氧化物中的陷阱产生来解释电池堆的退化和击穿。本文强调了SiN层优化在SANOS存储器的P / E操作期间可靠地维持大MW的重要性。

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