Thermal state modeling in thermosensitive elements of microelectronic devices with reach-through foreign inclusions

摘要

The nonlinear boundary axially symmetric problem of heat conduction for theudthermosensitive piecewise homogeneous layer with reach-through cylindrical inclusionudthat generates heat has been considered. Using the introduced function, the partialudlinearization of the original problem has been carried out. With the proposed piecewiselinearudapproximation of temperature at the boundary surface of the foreign inclusion andudon the contact surface of the homogeneous elements of the layer, the problem has beenudcompletely linearized. The analytical solution of this problem of finding the introducedudfunction using Hankel integral transform has been formed. The formulae for calculatingudthe desired temperature have been derived.