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Methods of obtaining instantaneous modulus of viscoelastic solids using displacement-controlled instrumented indentation with axisymmetric indenters of arbitrary smooth profiles

机译：使用轴对称压头的轴对称压痕获得粘弹性固体瞬时模量的方法

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Yang-Tse Cheng; Che-Min Cheng; Wangyang Ni;
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年度 2006
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1. Methods of obtaining instantaneous modulus of viscoelastic solids using displacement-controlled instrumented indentation with axisymmetric indenters of arbitrary smooth profiles [J] . Yang-Tse Cheng, Che-Min Cheng, Wangyang Ni Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing . 2006,第1a2期

机译：使用带有任意光滑轮廓的轴对称压头的位移控制仪器压痕获得粘弹性固体瞬时模量的方法
2. Obtaining shear relaxation modulus and creep compliance of linear viscoelastic materials from instrumented indentation using axisymmetric indenters of power-law profiles [J] . Yang-Tse Cheng, Fuqian Yang Journal of Materials Research . 2009,第10期

机译：使用幂律轮廓的轴对称压头从仪器压痕获得线性粘弹性材料的剪切松弛模量和蠕变柔度
3. General relationship between contact stiffness, contact depth, and mechanical properties for indentation in linear viscoelastic solids using axisymmetric indenters of arbitrary profiles [J] . Yang-Tse Cheng, Che-Min Cheng Applied Physics Letters . 2005,第11期

机译：使用任意轮廓的轴对称压头在线性粘弹性固体中压痕的接触刚度，接触深度和机械性能之间的一般关系
4. Investigation of Relationship between Instrumented Indentation Nominal Hardness and Reduced Elastic Modulus with Large Apex Angle Indenter [C] . Dejun Ma, Junhong Guo, Wei Chen, International Applied Mechanics, Mechatronics Automation System Simulation Meeting . 2012

机译：仪表压痕标称硬度与大顶角压痕减少弹性模量的研究
5. Limit case analysis of the stable indenter velocity method for obtaining creep stress exponents from constant load indentation creep tests [O] . J. Campbell, J. Dean, T. W. Clyne -1

机译：从恒定载荷压痕蠕变测试获得蠕变应力指数的稳定压头速度方法的极限情况分析
6. On the initial unloading slope in indentation of elastic-plastic solids by an indenter with an axisymmetric smooth profile [O] . Che-Min Cheng (Zheng Zhemin), Yang-Tse Cheng 1997

机译：轴对称平滑轮廓用压痕初始卸料斜面。轴对称平滑轮廓

Methods of obtaining instantaneous modulus of viscoelastic solids using displacement-controlled instrumented indentation with axisymmetric indenters of arbitrary smooth profiles

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