Complex processing of tin-lead dross into solders and ligatures

机译：将锡铅渣的复合加工成焊料和韧带

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B. M. Nemenenok; G. V. Downar; A. G. Slutsky; V. A. Sheinert; D. O. Kapusta; I. I. Loganiyk; A. D. Rulenkov;
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1. Influence of minute amount of elements Bi, Ag and In on surface tension and soldering process performance of tin-lead based solders [J] . X. P. ZHANG, H. W. WANG, Y. W. SHI Journal of Materials Science. Materials in Electronics . 2004,第8期

机译：微量元素Bi，Ag和In对锡铅基焊料的表面张力和焊接工艺性能的影响
2. Computer modeling of the coarsening process in tin-lead solders [J] . Lun Li, Wolfgang H. Muller Computational Materials Science . 2001,第2期

机译：锡铅焊料中粗化过程的计算机建模
3. The Reduction and Control of Dross in the Wave Solder Process [J] . Heather Benedict, Tim Pitsch, Michael Yuen Circuits Assembly . 1998,第7期

机译：波峰焊过程中焊渣的减少和控制
4. DEVELOPMENT OF PROCESSING PARAMETERS FOR SOLDERING LEAD-FREE BALL GRID ARRAYS USING TIN-LEAD SOLDER [C] . W. Fox, B. Gumpert, L. Woody SMTA International Conference . 2013

机译：使用锡引线焊料焊接无铅球栅阵列的加工参数的开发
5. Microstructural changes under isothermal aging and their influence on thermal fatigue reliability for tin-lead and lead-free solder joints, including microstructural changes under isothermal aging in mixed solder joints [D] . Choubey, Anupam 2007

机译：锡铅和无铅焊点在等温老化下的微观结构变化及其对热疲劳可靠性的影响，包括混合焊点在等温老化下的微观结构变化
6. Effect of Indium Content on the Melting Point Dross and Oxidation Characteristics of Sn-2Ag-3Bi-xIn Solders [O] . Ae-Jeong Jeon, Seong-Jun Kim, Sang-Hoon Lee, -1

机译：铟含量对Sn-2Ag-3Bi-xIn焊料的熔点熔渣和氧化特性的影响
7. Selective potentiometric determination of silver in tin and tin-lead solders with indicator modified carbon paste electrode [O] . L. K. Neudachina, Iu. S. Petrova, D. A. Rakov 2014

机译：用指示剂改性碳浆料电极选择性电位测定锡和锡铅焊料中的银
8. Nature and Growth Kinetics of the Diffusion Layer of Copper Joints Soldered by Tin-Lead Solders [R] . Il'evskii, I. I. 1980

机译：锡铅焊料焊接铜接头扩散层的性质和生长动力学

Complex processing of tin-lead dross into solders and ligatures

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