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Characterization of wafer geometry and overlay error on silicon wafers with nonuniform stress

机译：硅晶片晶圆几何形状的表征，硅晶片与非均匀应力

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Timothy A. Brunner; Vinayan C. Menon; Cheuk Wun Wong; Oleg Gluschenkov; Michael P. Belyansky; Nelson M. Felix; Christopher P. Ausschnitt; Pradeep Vukkadala; Sathish Veeraraghavan; Jaydeep K. Sinha;
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1. Optical characterization of double-side-textured silicon wafer based on photonic nanostructures for thin-wafer crystalline silicon solar cells [J] . Tayagaki Takeshi, Furuta Daichi, Aonuma Osamu, Japanese journal of applied physics . 2017,第4S期

机译：基于光子纳米结构的双面纹理化硅晶片的光学表征，用于薄晶片晶体硅太阳能电池
2. Predicting distortions and overlay errors due to wafer deformation during chucking on lithography scanners [J] . Kevin T. Turner Sathish Veeraraghavan and Jaydeep K. Sinha Journal of Micro/Nanolithography,MEMS and MOEMS . 2009,第4期

机译：预测在光刻扫描仪吸盘期间由于晶片变形而引起的变形和覆盖误差
3. Effect of Growth Rate and Wafering on Residual Stress of Diamond Wire Sawn Silicon Wafers [J] . Arkadeep Kumar, R.G.R. Prasath, Vanessa Pogue, Procedia Manufacturing . 2016,第期

机译：生长速率与晶片对金刚石锯硅晶片残余应力的影响
4. Characterization and mitigation of overlay error on silicon wafers with nonuniform stress [C] . T. Brunner, V. Menon, C. Wong, Optical microlithography XXVII . 2014

机译：应力不均匀的硅晶片上重叠误差的表征和缓解
5. Predicting overlay errors on device wafers due to the interaction of optical and EUV lithography fabrication processes [D] . Zheng, Liang 2006

机译：预测由于光学和EUV光刻制造工艺的相互作用而导致的器件晶圆上的覆盖错误
6. Silicon Wafer Functionalization with a Luminescent Tb(III) Coordination Complex: Synthesis Characterization and Application to the Optical Detection of NO in the Gas Phase [O] . Bijal K. Bahuleyan, Kathleen Toussaint, Hervé Rinnert, 2019

机译：发光Tb（III）配合物对硅晶圆的功能化：合成表征和气相中NO的光学检测中的应用
7. Effect of Growth Rate and Wafering on Residual Stress of Diamond Wire Sawn Silicon Wafers [O] . Kumar Arkadeep, Prasath R.G.R., Pogue Vanessa, 2016

机译：生长速度和硅片对金刚石线锯硅片残余应力的影响

Characterization of wafer geometry and overlay error on silicon wafers with nonuniform stress

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