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Equivalent Circuit-Based Open-Circuit Sensitivity Modelling of a Capacitive-Type MEMS Acoustic Sensor on Wafer Level

机译:晶圆级电容式MEMS声学传感器的等效电路开路灵敏度建模

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摘要

Equivalent circuit-based analytical open-circuit sensitivity modelling of a capacitive-type MEMS acoustic sensor for Internet of things (IoT) application is presented. It can not only evaluate simply the characteristic of the sensitivity on wafer level, but also improve the accuracy of the sensitivity due to including the fringing field between the diaphragm and each etching hole in the back-plate. The effective capacitor model is obtained by applying the approximately linearized electric-field method (ALEM), resulting in the equivalent circuit-based dynamic model. From the sensor with a 325 µm-radius diaphragm, the effective radius and the effective residual stress of the diaphragm were extracted to be 299 µm and +23.0 MPa, respectively. With the pull-in voltage of. 12.0 V and the pad capacitance of 0.23 pF; the open-circuit sensitivity was modelled to 11.3 mV/Pa at 1 kHz in the bias of 10 V.
机译:提出了一种基于电容类型MEMS声学传感器的基于等效电路的分析开路灵敏度建模(IOT)应用程序。它不仅可以简单地评估晶片水平对敏感度的特征,而且还可以提高由于在后板中的隔膜和每个蚀刻孔之间的条纹场而改善了灵敏度的准确性。通过应用近似线性化的电场方法(ALEM)获得有效电容器模型,从而产生基于等效电路的动态模型。从具有325μm半径膜片的传感器,膜片的有效半径和有效残余应力分别为299μm和+ 23.0MPa。随着拉伸电压。 12.0 V和0.23 PF的焊盘电容;在10V的偏差中,开路敏感度在1 kHz的1 kHz上建模为11.3 mV / PA。

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