The ontology based FMEA of lead free soldering process

机译：基于本体的无铅焊接工艺FMEA

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Martin Molhanec; Olga Zhuravskaya; Evgeniya Povolotskaya; Larisa Tarba;
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年度 2011
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1. Assessing the value of a lead-free solder control plan using cost-based FMEA [J] . Lillie Edwin, Sandborn Peter, Humphrey David Microelectronics reliability . 2015,第6期

机译：使用基于成本的FMEA评估无铅焊料控制计划的价值
2. Complex evaluation and development of electrolytic tin refining in acidic chloride media for processing tin-based scrap from lead-free soldering [J] . T. Kulcsar, G. B. Toth, T. Kekesi Transactions of the Institutions of Mining and Metallurgy, Section C. Mineral Processing and Extractive Metallurgy . 2016,第4期

机译：在酸性氯化物介质中电解锡精炼的综合评估和开发，以处理无铅焊接中的锡基废料
3. Modeling the Interdependence of Processing and Alloy Composition on the Evolution of Microstructure in Sn-Based Lead-Free Solders in Fine Pitch Flip Chip [J] . Zhiheng Huang, Paul P. Conway, Changqing Liu, IEEE Transactions on Components and Packaging Technologies . 2006,第1期

机译：细间距倒装芯片中锡基无铅焊料的微观结构演变过程与合金成分的相互依赖性建模
4. The ontology based FMEA of lead free soldering process [C] . Molhanec Martin, Zhuravskaya Olga, Povolotskaya Evgeniya, 2011 34th International Spring Seminar on Electronics Technology . 2011

机译：基于本体的无铅锡焊工艺FMEA
5. A Study on Process, Strength and Microstructure Analysis of Low Temperature SnBi-Containing Solder Pastes Mixed with Lead-free Solder Balls [D] . Kannammal Palaniappan, Sakthi Cibi. 2016

机译：低温SNBI焊膏的工艺，强度和微观结构分析混合无铅焊球
6. Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components [O] . Marina Makrygianni, Filimon Zacharatos, Kostas Andritsos, 2021

机译：通过激光引导的超细俯仰电子元件组装的激光诱导的前进转印的环保无铅焊膏印刷
7. The Ontology based FMEA of Lead Free Soldering Process [O] . Molhanec Martin, Mach Pavel, Mensah David Asamoah Bamfo 2010

机译：基于本体的无铅锡焊工艺FMEA
8. AgSn-Based Solder Alloys and Solder/Conductor Interactions in Lead-Free Electronics [R] . Korhonen, T. M. 2001

机译：基于agsn的焊料合金和无铅电子器件中的焊料/导体相互作用

The ontology based FMEA of lead free soldering process

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