Packaging of a high-speed optical modulator using flip chip interconnects

摘要

Optical modulators using lithium niobate (LiNbO3) have become the industry standard for high-speed data transmission and RF photonic links. Packaging is a determining factor in maintaining low cost and high-performance. This paper investigates the application of flip chip technology to optical modulator packaging. Experimental results show that rugged flip chip bonds can be realized with minimal impact on the modulator electrical performance.