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Development of a microelectromechanical system (MEMS)-based multisensor platform for environmental monitoring

机译:基于微机电系统(MEMS)的多传感器平台的环境监测开发

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摘要

Recent progress in data processing, communications and electronics miniaturization is now enabling the development of low-cost wireless sensor networks (WSN), which consist of spatially distributed autonomous sensor modules that collaborate to monitor real-time environmental conditions unobtrusively and with appropriate levels of spatial and temporal granularity. Recent and future applications of this technology range from preventative maintenance and quality control to environmental modelling and failure analysis. In order to fabricate these low-cost, low-power reliable monitoring platforms, it is necessary to improve the level of sensor integration available today. This paper outlines the microfabrication and characterization results of a multifunctional multisensor unit. An existing fabrication process for Complementary Metal Oxide Semiconductor CMOS-compatible microelectromechanical systems (MEMS) structures has been modified and extended to manufacture temperature, relative humidity, corrosion, gas thermal conductivity, and gas flow velocity sensors on a single silicon substrate. A dedicated signal conditioning circuit layer has been built around this MEMS multisensor die for integration on an existing low-power WSN module. The final unit enables accurate readings and cross-sensitivity compensation thanks to a combination of simultaneous readings from multiple sensors. Real-time communication to the outside world is ensured via radio-frequency protocols, and data collection in a serial memory is also made possible for diagnostics applications.
机译:数据处理,通信和电子微型化方面的最新进展现在使低成本无线传感器网络(WSN)的发展成为可能,该网络由空间分布的自主传感器模块组成,这些模块可以配合使用,以适当的空间水平监视实时环境状况和时间粒度。该技术的最新和未来应用范围从预防性维护和质量控制到环境建模和故障分析。为了制造这些低成本,低功耗的可靠监控平台,有必要提高当今可用的传感器集成度。本文概述了多功能多传感器单元的微细加工和表征结果。互补金属氧化物半导体CMOS兼容微机电系统(MEMS)结构的现有制造工艺已被修改并扩展为在单个硅基板上制造温度,相对湿度,腐蚀,气体导热率和气体流速传感器。围绕该MEMS多传感器芯片构建了专用的信号调节电路层,用于集成在现有的低功耗WSN模块上。由于来自多个传感器的同时读数,最终单元可以实现准确的读数和交叉灵敏度补偿。通过射频协议确保与外界的实时通信,并且还可以将串行存储器中的数据收集用于诊断应用程序。

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