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Characterisation and modelling of degradation mechanisms in RF MEMS capacitive switches during hold-down operation

机译:压制操作期间RF MEMS电容开关的降级机制的表征和建模

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摘要

RF MEMS switches represent an attractive alternative technology to current mechanical (e.g. coaxial and waveguide) and solid-state (e.g. PIN diode and FET transistor) RF switch technologies. The materials and fabrication techniques used in MEMS manufacture enable mechanically moveable devices with high RF performance to be fabricated on a miniature scale. However, the operation of these devices is affected by several mechanical and electrical reliability concerns which limit device lifetimes and have so far prevented the widespread adoption and commercialisation of RF MEMS. While a significant amount of research and development on RF MEMS reliability has been performed in recent years, the degradation mechanisms responsible for these reliability concerns are still poorly understood. This is due to the multi-physical nature of MEMS switches where multiple mechanical and electrical degradation mechanisms can simultaneously affect device behaviour with no clear way of distinguishing between their individual effects. As such, little progress has been made in proposing solutions to these reliability concerns. While some RF MEMS switches have recently been commercialised, their success has come at the expense of decreased performance due to design changes necessarily imposed to prevent device failure. However, more high performance switches could be developed if the mechanisms responsible for reliability problems could be understood and solved. The work of this thesis is focussed on the isolation and study of individual reliability mechanisms in RF MEMS capacitive switches. A bipolar hold-down technique is used to minimise the effects of dielectric charging and allow mechanical degradation to be studied in isolation in aluminium-based capacitive switches. An investigation of mechanical degradation leads to the identification of grain boundary sliding as the physical process responsible for the decreased mechanical performance of a switch. An alternative material for the switch movable electrode is investigated and shown to be mechanically robust. The effects of dielectric charging are isolated from mechanical degradation using mechanically robust switches. The isolated investigation of dielectric charging leads to the identification of two major charging mechanisms which take place at the bulk and surface of the dielectric, respectively. The exchange of charge from interface traps is identified as the physical mechanism responsible for bulk dielectric charging. An investigation of surface dielectric charging reveals how this reliability concern depends on the structure and design of a switch. Finally, electrical and material means of minimising dielectric charging are investigated. The findings and results presented in this thesis represent a significant contribution to the state-of the- art understanding of RF MEMS capacitive switch reliability. By implementing the design changes and material solutions proposed in this work, the performance and lifetime of RF MEMS capacitive switches can be greatly improved.
机译:RF MEMS开关代表了当前机​​械(例如同轴电缆和波导)和固态(例如PIN二极管和FET晶体管)RF开关技术的一种有吸引力的替代技术。 MEMS制造中使用的材料和制造技术使具有高RF性能的机械可移动设备能够以微型规模制造。但是,这些设备的操作受到一些机械和电气可靠性问题的影响,这些问题限制了设备的使用寿命,并迄今为止阻止了RF MEMS的广泛采用和商业化。尽管近年来已对RF MEMS可靠性进行了大量研究和开发,但对引起这些可靠性问题的降级机制仍知之甚少。这是由于MEMS开关具有多种物理特性,其中多种机械和电气降级机制可以同时影响设备行为,而没有清晰的方式来区分它们的各个影响。因此,在提出针对这些可靠性问题的解决方案方面进展甚微。尽管一些RF MEMS开关最近已商业化,但其成功是以牺牲性能为代价的,这归因于为防止设备故障而必须进行的设计更改。但是,如果可以理解和解决造成可靠性问题的机制,则可以开发出更高性能的交换机。本文的工作重点是隔离和研究RF MEMS电容开关中各个可靠性机制。使用双极压制技术可最大程度地减少介电电荷的影响,并允许在基于铝的电容式开关中隔离地研究机械性能下降。对机械退化的研究导致将晶界滑动识别为导致开关机械性能下降的物理过程。研究了用于开关可动电极的替代材料,并显示出机械上的坚固性。使用机械坚固的开关可将介电电荷的影响与机械性能降低隔离。对介电电荷的孤立研究导致确定了两种主要的电荷机制,分别发生在介电质的主体和表面。来自界面陷阱的电荷交换被确定为负责体电介质充电的物理机制。对表面介电电荷的研究揭示了这种可靠性问题如何取决于开关的结构和设计。最后,研究了使电介质电荷最小化的电气和材料手段。本文提出的发现和结果代表了对RF MEMS电容开关可靠性的最新理解的重要贡献。通过实施这项工作中提出的设计更改和材料解决方案,可以大大提高RF MEMS电容开关的性能和寿命。

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  • 作者

    Ryan Cormac;

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  • 年度 2016
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  • 原文格式 PDF
  • 正文语种 en
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