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Distortion in conformable masks for evanescent near field optical lithography

机译:瞬态近场光学光刻的适形掩模中的失真

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摘要

In this thesis the in-plane pattern distortion resulting from the use of Evanescent Near Field Optical Lithography (ENFOL) masks was investigated. ENFOL is a high resolution low-cost technique of lithography that is able to pattern features beyond the diffraction limit of light. Due to its use of the evanescent near field, ENFOL requires the use of conformable masks for intimate contact. Such masks can stretch and skew as they come into contact with silicon substrates and therefore distort the high resolution features patterned on them. It was desired to measure this distortion to ascertain the patterning performance of ENFOL masks and possibly correct for any uniform distortion found. To this end a sophisticated measuring process was successfully demonstrated. This involved the use of a Raith 150 Electron Beam Lithography (EBL) system with precision laser interferometer stage and metrology software module for automated measurements. Custom software was written for the Raith to enable it to take additional measurements to compensate for electron beam drift. Processing algorithms were then employed to using the measurements to compensate for beam drift and correcting for shift and rotation systematic errors. The performance of the in-plane distortion measuring process was found to have a precision of 60nm. With the ability to measure distortion, ENFOL masks were used to pattern substrates and distortion was found to be large, on the order of 1µm. This is much larger than desired for sub 100nm patterning as is expected of ENFOL. The distortions were non-uniform patterns of localised displacements. This, the observation of Newton's rings beneath a test mask and the observation of a single particle distortion across measurements of the same mask across different loadings in the EBL pointed to particulate contamination causing the distortion. In order to prove beyond doubt that particulate contamination was the cause of the spurious distortions, mechanical modelling using the Finite Element Method (FEM) of analysis was employed. The results from this matched the distortions observed experimentally, particles 20-40µm modelling the observed distortion.
机译:本文研究了由于使用瞬逝近场光学光刻技术(ENFOL)掩模引起的面内图案失真。 ENFOL是一种高分辨率的低成本光刻技术,能够对超出光的衍射极限的特征进行构图。由于使用了瞬逝近场,因此ENFOL要求使用合适的面罩进行紧密接触。当这些掩模与硅衬底接触时,它们会拉伸和歪斜,因此会使在其上构图的高分辨率特征变形。希望测量这种畸变以确定ENFOL掩模的构图性能,并可能校正发现的任何均匀畸变。为此,成功地演示了复杂的测量过程。这涉及将Raith 150电子束光刻(EBL)系统与精密激光干涉仪平台和计量软件模块配合使用以进行自动测量。为Raith编写了定制软件,以使其能够进行额外的测量以补偿电子束漂移。然后采用处理算法来使用这些测量值来补偿光束漂移并校正位移和旋转系统误差。面内畸变测量过程的性能被发现具有60nm的精度。具有测量变形的能力,使用ENFOL掩模对基板进行构图,发现变形很大,约为1µm。如ENFOL所预期的,这比亚100nm图案所需的要大得多。变形是局部位移的非均匀模式。这样,观察到测试掩模下方的牛顿环,并观察到在EBL中不同载荷下同一掩模的测量结果中的单个颗粒变形,表明微粒污染会导致变形。为了毫无疑问地证明微粒污染是伪失真的原因,采用了使用有限元方法(FEM)进行分析的机械模型。结果与实验中观察到的变形相匹配,用20-40μm的颗粒模拟了观察到的变形。

著录项

  • 作者

    Wright Alan James;

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  • 年度 2007
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  • 原文格式 PDF
  • 正文语种 en
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