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Stochastic Models of Surface Limited Electronic and Heat Transport in Metal and Semiconductor Contacts, Wires, and Sheets — Micro to Nano

机译:金属和半导体触点,导线和片材中表面限制电子和热传输的随机模型 - 微纳米

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摘要

We introduce novel statistical simulation approaches to include the e ect ofsurface roughness in coupled mechanical, electronic and thermal processesin N/MEMS and semiconductor devices in the 10 nm - 1 m range. A modelis presented to estimate roughness rms and autocorrelation L from experimentalsurfaces and edges, and subsequently generate statistical seriesof rough geometrical devices from these observable parameters. Using suchseries of rough electrodes under Holm's theory, we present a novel simulationframework which predicts a contact resistance of 80 m in MEMSgold-gold micro-contacts, for applied pressures above 0.3 mN on 1 m 1 m surfaces. The non-contacting state of such devices is simulated throughstatistical Monte Carlo iterations on percolative networks to derive a timeto electro-thermal failure through electrical discharges in the gas insulatingmetal electrodes. The observable parameters L and are further integratedin semi-classical solutions to the electronic and thermal Boltzman transportequation (BTE), and we show roughness limited heat and electronic transportin rough semiconductor nanowires and nano-ribbons. In this scope, wemodel for the rst time electrostatically con ned nanowires, where a reductionof electron - surface scattering leads to enhanced mobility in comparisonto geometrical nanowires. In addition, we show extremely low thermal conductivityin Si, GaAs, and Ge nanowires down to 0.1 W/m/K for thin Gewires with 56 nm width and = 3 nm. The dependency of thermal conductivityin (D= )2 leads to possible application in the eld of thermoelectricdevices. For rough channels of width below 10 nm, electronic transport isadditionally modeled using a novel non-parabolic 3D recursive Green functionscheme, leading to an estimation of reduced electronic transmission inrough semiconductor wires based on the quantum nature of charge carriers.Electronic and thermal simulation schemes are nally extended to such 2Dsemiconductor materials as graphene, where low thermal conductivity is approximatedbelow 1000 W/m/K for rough suspended graphene ribbons inaccordance with recent experiments.
机译:我们介绍了新颖的统​​计模拟方法,以包括N / MEMS和10nm-1 m范围内的半导体器件中机械,电子和热耦合过程中的表面粗糙度影响。提出了一个模型,以从实验表面和边缘估计粗糙度均方根值和自相关L,然后从这些可观察参数生成统计系列的粗糙几何装置。在Holm的理论下使用这种系列的粗糙电极,我们提出了一种新颖的模拟框架,该框架预测在MEMS金-金微接触中,在1 m 1 m的表面上施加的压力大于0.3 mN时,接触电阻为80 m。通过在渗滤网络上进行统计蒙特卡洛迭代来模拟此类设备的非接触状态,以通过气体绝缘金属电极中的放电得出电热失效的时间。可观察到的参数L和进一步集成到电子和热玻尔兹曼输运方程(BTE)的半经典解中,并且我们显示了在粗糙的半导体纳米线和纳米带中的粗糙度受限的热和电子输运。在此范围内,我们首次建模了静电约束纳米线,与几何纳米线相比,电子-表面散射的减少导致迁移率提高。此外,对于宽度为56 nm且= 3 nm的细Gewire,我们在Si,GaAs和Ge纳米线中显示出极低的导热系数,低至0.1 W / m / K。导热系数(D =)2的依赖性导致在热电器件领域的可能应用。对于宽度小于10 nm的粗糙通道,还使用新颖的非抛物线3D递归Green函数方案对电子传输进行了建模,从而基于电荷载流子的量子性质估计了降低的半导体半导体传输线的电子传输和电子仿真方案。最终扩展到诸如石墨烯的2D半导体材料,根据最近的实验,对于粗糙的悬浮石墨烯带,其低热导率大约低于1000 W / m / K。

著录项

  • 作者

    Martin Pierre N.;

  • 作者单位
  • 年度 2010
  • 总页数
  • 原文格式 PDF
  • 正文语种 {"code":"en","name":"English","id":9}
  • 中图分类

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