Toward a constitutive model for cure dependent modulus of a high temperatureepoxy during the cure

摘要

A constitutive model, based on Kohlrausch-Williams-Watts (KWW) equations, wasdeveloped to simulate the evolution of the dynamic relaxation modulus during thecure of a "high temperature' epoxy. The basic assumption of the modellingmethodology proposed is the equivalence of the mechanisms underlying theevolution of the glass transition temperature and the relaxation time shiftduring the cure, leading to the use of a common potential function. Thisassumption is verified by the comparison of normalized glass transition data andprincipal relaxation times, which have been found to follow a single mastercurve. Results show satisfactory agreement between experimental data and modelprediction over the range of chemical conversion considered.